Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | TLX-8 |
| PCB size | 108.72mm x 59.59 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) |
| Surface finish | Immersion Gold |
| Layer count | 2-layer |
| PCB Thickness | 1.6mm |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | TLX-8 | PCB size | 108.72mm x 59.59 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) | Surface finish | Immersion Gold |
| Layer count | 2-layer | PCB Thickness | 1.6mm |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 60mil Immersion Gold Rigid Circuits ，TLX-8 Immersion Gold Rigid Circuits ，Immersion Gold pcb 2 layer | ||
The TLX-8 is a PTFE fiberglass laminate material designed for reliable performance in a wide range of RF applications. Its versatility comes from the availability of various thicknesses and copper cladding options. This material is well-suited for low-layer-count microwave designs, offering mechanical reinforcement for use in severe environments such as:
- High-vibration conditions during space launch
- High-temperature exposure in engine modules
- Radiation-rich environments in space
- Extreme marine conditions for warship antennas
- Wide temperature ranges for altimeter substrates
Key Benefits
- Excellent PIM (Passive Intermodulation) performance, measured at less than -160 dBc
- Excellent mechanical and thermal properties
- Low and stable dielectric constant (Dk)
- Dimensionally stable with low moisture absorption
- Tightly controlled Dk
- Low dissipation factor (Df)
- UL 94 V0 flammability rating
- Suitable for low-layer-count microwave designs
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Technical Specifications
Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity (Elevated Temp.): 6.605 x 10^8 Mohm
- Surface Resistivity (Humidity Cond.): 3.550 x 10^6 Mohm
- Volume Resistivity (Elevated Temp.): 1.110 x 10^10 Mohm/cm
- Volume Resistivity (Humidity Cond.): 1.046 x 10^10 Mohm/cm
Dimensional Stability
- MD After Bake: 0.06 mm/M (mils/in)
- CD After Bake: 0.08 mm/M (mils/in)
- MD Thermal Stress: 0.09 mm/M (mils/in)
- CD Thermal Stress: 0.10 mm/M (mils/in)
CTE (25-260 °C)
- X: 21 ppm/°C
- Y: 23 ppm/°C
- Z: 215 ppm/°C
Thermal Properties
- 2% Weight Loss: 535 °C
- 5% Weight Loss: 553 °C
Chemical/Physical Properties
- Moisture Absorption: 0.02%
- Dielectric Breakdown: > 45 kV
- Flammability Rating: V-0 (UL-94)
PCB Construction
- 2-layer rigid PCB
- Copper layer 1: 35 μm
- Taconic TLX-8 Core: 1.524 mm (60 mil)
- Copper layer 2: 35 μm
- Board dimensions: 108.72 mm x 59.59 mm ± 0.15 mm
- Minimum trace/space: 5/5 mils
- Minimum hole size: 0.3 mm
- Finished board thickness: 1.6 mm
- Finished copper weight: 1 oz (1.4 mils) on outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion gold
- Top silkscreen: White
- Bottom silkscreen: None
- Top solder mask: None
- Bottom solder mask: None
- 100% electrical test prior to shipment
Availability
Worldwide
Typical Applications
- Radar systems
- Mobile communications
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, amplifiers, and antennas
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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