Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RO3003G2 |
| PCB size | 41.71mm x 64mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) |
| Surface finish | Immersion gold |
| Layer count | 2-layer |
| PCB Thickness | 0.2mm |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RO3003G2 | PCB size | 41.71mm x 64mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) | Surface finish | Immersion gold |
| Layer count | 2-layer | PCB Thickness | 0.2mm |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Immersion Gold Circuits PCB ，5mil PCB ，RO3003G2 PCB | ||
The Rogers RO3003G2 is a high-performance, ceramic-filled PTFE laminate designed for millimeter wave automotive radar applications. This latest iteration of Rogers' industry-leading RO3003 solutions was developed based on customer feedback to address the next-generation needs of ADAS (Advanced Driver Assistance Systems) like adaptive cruise control, forward collision warning, and lane change assist.
Key Features:
- Dielectric constant (Dk) of 3.0 ±0.04 at 10 GHz and 3.07 at 77 GHz
- Low dissipation factor of 0.0011 at 10 GHz
- Excellent thermal coefficient of dielectric constant (-35 ppm/°C)
- Very low profile (VLP) electrodeposited (ED) copper
- Copper-matched coefficient of thermal expansion (CTE) for enhanced reliability
- Homogeneous construction with reduced dielectric porosity
| PROPERTY | RO3003G2 | Direction | Unit | condition | Test Method |
| Dielectric Constant, er Process | 3.00 ± 0.04 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, er Design | 3.07 | Z | - | 77 GHZ | Differential Phase Length Method |
| Dissipation Factor, tan d | 0.0011 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of er | -35 | Z | ppm/°C | 10 GHz -50 to 150°C |
IPC-TM-650 2.5.5.5 |
| Dimensional Stability | -0.16 -0.14 |
X Y |
mm/m | Method C | IPC TM-650 2.2.4 |
| Volume Resistivity | 1.4 x 10^9 | - | MΩ•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 2.6 x 10⁸ | - | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 378 396 |
X Y |
ksi | 23°C | ASTM D638 |
| Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.73 0.83 |
Z | J/g/K | 0°C 50°C |
ASTM E1269-11 |
| Thermal Conductivity | 0.43 | Z | W/m/K | 50°C | ASTM D5470 |
| Coefficient of Thermal Expansion | 16 17 18 |
X Y Z |
ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | - | °CTGA | - | ASTM D3850 |
| Density | 2.15 | - | gm/cm3 | 23°C | ASTM D792 |
| Copper Peel Strength | 12.0 | - | lb/in | 1/2 oz. EDC After Solder Float |
IPC-TM-2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead Free Process Compatible | YES | - | - | - | - |
| PCB Material: | Ceramic-filled PTFE Laminates |
| Designation: | RO3003G2 |
| Dielectric constant: | 3 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Benefits:
- Best-in-class performance for insertion loss
- Minimized dielectric constant variation in finished PCB
- Enables the trend toward smaller-diameter vias
This 2-layer rigid PCB features a 0.127 mm (5 mil) Rogers RO3003G2 core with 35 μm copper layers. It measures 41.71 mm x 64 mm with a finished thickness of 0.2 mm. The PCB has a minimum trace/space of 4/5 mils, a minimum hole size of 0.3 mm, and an immersion gold surface finish.
Applications:
It meets IPC-Class-2 quality standards, the RO3003G2 PCB is well-suited for a variety of ADAS applications, including adaptive cruise control, forward collision warning, active brake assist, lane change assist, traffic jam pilot, parking pilot, and blind spot detection.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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