Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RF-35TC |
| PCB size | 48.17 mm x 47.7 mm=3PCS = 3 Types, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) |
| Surface finish | Immersion gold |
| Layer count | 2-layer |
| PCB Thickness | 0.2mm |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RF-35TC | PCB size | 48.17 mm x 47.7 mm=3PCS = 3 Types, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) | Surface finish | Immersion gold |
| Layer count | 2-layer | PCB Thickness | 0.2mm |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 1OZ RF-35TC PCB ，5mil RF-35TC PCB ，Double-sided RF-35TC PCB | ||
Introduction:
The RF-35TC PCB is a cutting-edge high-frequency material that offers best-in-class low dissipation factor and exceptional thermal conductivity. Designed for demanding high-power RF and microwave applications, this PTFE-based, ceramic-filled fiberglass substrate provides unparalleled performance where minimizing signal loss and efficiently dissipating heat are critical.
Features:
Thermally conductive low loss laminate with a dielectric constant of 3.5 ± 0.05 at 10 GHz/23°C
Ultra-low dissipation factor of 0.002 at 10 GHz/23°C
Impressive thermal conductivity of 0.87 W/m/K for 0.5 oz copper, 0.92 W/m/K for 1 oz copper
Excellent dimensional stability with low CTE of 11 ppm/°C (X-axis), 13 ppm/°C (Y-axis), 34 ppm/°C (Z-axis)
High thermal reliability with 5% weight loss temperature of 436°C
Low moisture absorption of only 0.05%
| RF-35TC TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.5.1(modified) | 3.5 | 3.5 | ||
| Tck(-30 to 120℃) | IPC-650 2.5.5.5.1(modified) | ppm | 24 | ppm | 24 |
| Df @10 GHz | IPC-650 2.5.5.5.1(modified) | 0.0011 | 0.0011 | ||
| Dielectric Breakdown | IPC-650 2.5.6(in-Plane,Two Pins in Oil) | kV | 56.7 | kV | 56.7 |
| Dielectric Strength | ASTM D 149(Through Plane) | V/mil | 570 | V/mm | 22,441 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | 304 | Seconds | 304 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.05 | % | 0.05 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 12,900 | N/mm2 | 88.94 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 11,700 | N/mm2 | 80.67 |
| Tensile Strength(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 9,020 | N/mm2 | 62.19 |
| Tensile Strength(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 7,740 | N/mm2 | 53.37 |
| Elongation at Break(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.89 | N/mm | 1.89 |
| Elongation at Break(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | % | 1.7 | % | 1.7 |
| Young's Modulus(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 667,000 | N/mm2 | 4,599 |
| Young's Modulus(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | psi | 637,000 | N/mm2 | 4,392 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.18 | 0.18 | ||
| Poisson's Ratio(CD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.23 | 0.18 | ||
| Compressive Modulus | ASTM D 695(23℃) | psi | 560,000 | N/mm2 | 3,861 |
| Flexural Strength(MD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.46 x 106 | N/mm2 | 10,309 |
| Flexural Strength(CD) | ASTM D 790/IPC-650 2.4.4 | psi | 1.50 x 106 | N/mm2 | 10,076 |
| Peel Stength(½ oz.CVH) | IPC-650 2.4.8(Thermal Stress.) | Ibs./inch | 7 | g/cm3 | 1.25 |
| Thermal Conductivity(Unclad,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.6 | W/(mK) | 0.6 |
| Thermal Conductivity(C1/C1,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.92 | W/(mK) | 0.92 |
| Thermal Conductivity(CH/CH,125℃) | ASTM F433(Guarded Heat Flow) | W/(mK) | 0.87 | W/(mK) | 0.87 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.23 | mm/M | 0.23 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.4(After Etch) | mils/in. | 0.64 | mm/M | 0.64 |
| Dimensional Stability(MD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | -0.04 | mm/M | -0.04 |
| Dimensional Stability(CD) | IPC-650-2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.46 | mm/M | 0.46 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 8.33 x 107 | Mohms | 8.33 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 6.42 x 107 | Mohms | 6.42 x 107 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 5.19 x 108 | Mohms/cm | 5.19 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 2.91 x 108 | Mohms/cm | 2.91 x 108 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 11 | ppm/℃ | 11 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 13 | ppm/℃ | 13 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 34 | ppm/℃ | 34 |
| Density | ASTM D 792 | g/cm3 | 2.35 | g/cm3 | 2.35 |
| Hardness | ASTM D 2240(Shore D) | 79.1 | 79.1 | ||
| Strain at Break(MD) | ASTM D 790/IPC-650 2.4.4 | % | 0.014 | % | 0.014 |
| Strain at Break(CD) | ASTM D 790/IPC-650 2.4.4 | % | 0.013 | % | 0.013 |
| Specific Heat | ASTM E 1269-05,E 967-08,E968-02 | j/(g℃) | 0.94 | j/(g℃) | 0.94 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 788 | ℃ | 420 |
| Td(5% Weight Loss) | IPC-650 2.4.24.6/TGA | oF | 817 | ℃ | 436 |
Benefits:
"Best in class" loss tangent for maximum efficiency and signal integrity
Exceptional thermal management to dissipate heat from high-power components
Stable dielectric properties across a wide temperature range
Enhanced antenna gains and radiation efficiencies
Robust adhesion to very thin copper foils for high-density PCB designs
This 2-layer rigid PCB features a 0.127 mm (5 mil) RF-35TC core with 35 μm copper layers and is constructed to the highest quality standards. With its industry-leading performance, the RF-35TC is the premier choice for demanding RF and microwave designs.
Applications:
The RF-35TC PCB is ideal for a wide range of high-frequency, high-power applications, including:
Filters, couplers, and power amplifiers
Antennas and satellite communications
Radar and sensing systems
Test and measurement equipment
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, h... Founded in 2003, Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communications, h...
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