Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RO3210 and RO3003 |
| Layer count | 3-layer |
| PCB size | 62.8mm x 62.8 mm=1PCS, +/- 0.15mm |
| PCB thickness | 3mm |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion Tin |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RO3210 and RO3003 | Layer count | 3-layer |
| PCB size | 62.8mm x 62.8 mm=1PCS, +/- 0.15mm | PCB thickness | 3mm |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Tin |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
Introducing our newly shipped hybrid printed circuit board (PCB), designed for high-frequency applications with unmatched performance and reliability. This advanced PCB combines Rogers’ RO3210 and RO3003 materials, providing a unique blend of mechanical stability and excellent electrical characteristics, making it ideal for a wide range of demanding applications.
Key Features
RO3210 Material
- Dielectric Constant (Dk): 10.2 ± 0.5
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Stability:
- Coefficient of Thermal Expansion (CTE):
- X & Y axes: 13 ppm/°C
- Z axis: 34 ppm/°C
- Decomposition Temperature (Td): 500 °C
- Thermal Conductivity: 0.81 W/mK
- Flammability Rating: V0 (UL 94 standard)
| RO3210 Typical Value | |||||
| Property | RO3210 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 10.8 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0027 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -459 | Z | ppm/℃ | 10 GHz 0℃to 100℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.8 | X, Y | mm/m | COND A | ASTM D257 |
| Volume Resistivity | 103 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 103 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 579 517 | MD CMD | kpsi | 23℃ | ASTM D 638 |
| Water Absorption | ＜0.1 | - | % | D24/23 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.79 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.81 | W/M/K | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 13 34 | X,Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 3 | gm/cm3 | |||
| Copper Peel Stength | 11 | pli | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
RO3003 Material
- Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Stability:
- Td: > 500 °C
- Coefficient of Thermal Expansion:
- X axis: 17 ppm/°C
- Y axis: 16 ppm/°C
- Z axis: 25 ppm/°C
- Moisture Absorption: 0.04%
- Thermal Conductivity: 0.5 W/mK
| RO3003 Typical Value | |||||
| Property | RO3003 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.001 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -3 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.06 0.07 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 107 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 107 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 930 823 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.04 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.9 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.5 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 16 25 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 12.7 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Specifications
- Stackup: 3-layer rigid PCB
- Copper Layer 1: 35 μm
- Rogers RO3003 Core: 1.524 mm (60 mil)
- RO4450F Bondply: 0.101 mm (4 mil)
- Rogers RO3210 Core: 1.27 mm (50 mil)
- Copper Layer 1: 35 μm
- Dimensions: 62.8 mm x 62.8 mm ± 0.15 mm
- Finished Board Thickness: 3.0 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.4 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Tin
- Electrical Testing: 100% electrical test prior to shipment
Application Areas
This hybrid PCB is tailored for various high-performance applications, including:
- Automotive Technologies: Collision avoidance systems and global positioning satellite antennas
- Telecommunications: Wireless systems, microstrip patch antennas, and direct broadcast satellites
- Remote Monitoring: Datalink on cable systems and remote meter readers
- Infrastructure Solutions: Power backplanes, LMDS, wireless broadband, and base station infrastructure
Quality Assurance
Manufactured to IPC-Class 2 standards, this PCB ensures high reliability and performance. The artwork is provided in Gerber RS-274-X format, making it compatible with standard PCB design tools.
Global Availability
Our hybrid PCB is available for worldwide shipping, allowing you to leverage cutting-edge technology in your projects, no matter your location.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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