Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RO4003C and FR-4 |
| Layer count | 6-layer |
| PCB size | 83.50mm x 66mm=1PCS, +/- 0.15mm |
| PCB thickness | 1.1mm |
| Copper weight | 1oz (1.4 mils) inner/outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RO4003C and FR-4 | Layer count | 6-layer |
| PCB size | 83.50mm x 66mm=1PCS, +/- 0.15mm | PCB thickness | 1.1mm |
| Copper weight | 1oz (1.4 mils) inner/outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
We are excited to announce our newly shipped 6-layer printed circuit board (PCB) designed with Rogers RO4003C materials. This innovative PCB combines exceptional electrical performance with manufacturing ease, making it a perfect solution for high-frequency applications.
Key Features
RO4003C Material
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
- CTE Matched to Copper:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z-axis CTE: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Non-Brominated
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
S1000-2M Features
- Enhanced Z-axis CTE for improved through-hole reliability
- Excellent mechanical processability and thermal resistance
- Lead-free compatibility
- Tg: 180°C (DSC)
- UV blocking and AOI compatible
- High heat resistance with superior anti-CAF performance
- Low water absorption
PCB Specifications
- Layer Stackup:
- Copper Layer 1: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- FR-4 (Tg 170): 0.076 - 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm
- Dimensions: 83.50 mm x 66 mm ± 0.15 mm
- Finished Board Thickness: 1.1 mm
- Finished Copper Weight: 1 oz (1.4 mils) on both inner and outer layers
-Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Solder Mask Color: Matt Green (top and bottom)
- Silkscreen Color: White (top only)
- Impedance Control: 50 ohm on 4 mil / 4 mil traces/gaps (top layer)
- Via Configuration: 0.2 mm via filled and capped
- Electrical Testing: 100% before shipment
Typical Applications
This PCB is ideal for a variety of advanced applications, including:
- Commercial airline broadband antennas
- Microstrip and stripline circuits
- Millimeter wave applications
- Radar systems
- Guidance systems
- Point-to-point digital radio antennas
Quality Assurance
Manufactured to IPC-Class 2 standards, our PCB ensures high reliability and performance. The artwork is supplied in Gerber RS-274-X format, compatible with most PCB design tools.
Global Availability
Our high-performance PCB is available for worldwide shipping, providing cutting-edge solutions wherever you are located.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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