Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RF-60TC |
| PCB Thickness | 10mil |
| PCB size | 49.44 mm x 36.88 mm ± 0.15 mm |
| Copper weight | 1OZ |
| Surface finish | Immersion Tin |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RF-60TC | PCB Thickness | 10mil |
| PCB size | 49.44 mm x 36.88 mm ± 0.15 mm | Copper weight | 1OZ |
| Surface finish | Immersion Tin | Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RF-60TC PCB ，Immersion Tin PCB ，10mil PCB | ||
We are excited to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-60TC, a high-frequency laminate designed for high-power RF and microwave applications. This advanced material combines ceramic-filled, glass-reinforced PTFE with exceptional thermal conductivity, making it ideal for miniaturized antenna designs and other high-efficiency applications.
Key Features
RF-60TC boasts a dielectric constant (Dk) of 6.15 at 10 GHz and a low dissipation factor of 0.002, providing improved gains and efficiencies in RF circuits. Its high thermal conductivity—1.0 W/m*K for 0.5 oz copper and 1.05 W/m*K for 1 oz—ensures effective heat dissipation, reducing operating temperatures and enhancing the reliability of active components. Additionally, RF-60TC has a low moisture absorption rate of 0.03% and a thermal coefficient of Dk of -3.58 ppm/°C, ensuring stable performance across a wide temperature range.
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
| TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
| Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
| Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
| Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
| Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
| Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
| Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
| Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
| CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
| CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
| Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
| Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
| Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
| Flammability Rating | UL 94 | V-0 | V-0 |
PCB Specifications
This PCB features a robust stackup consisting of:
- Copper Layer 1: 35 μm
- RF-60TC Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
The overall dimensions of the PCB are 49.44 mm x 36.88 mm ± 0.15 mm, with a finished thickness of 0.37 mm. It supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.25 mm. The PCB is designed without blind vias, featuring a finished copper weight of 1 oz (1.4 mils) on both outer layers.
For surface finish, the PCB uses immersion tin, and it has a white silkscreen on the top side, while the bottom remains clear of silkscreen and solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure optimal performance.
| PCB Material: | PTFE based, ceramic filled fiberglass |
| Designation: | RF-60TC |
| Dielectric constant: | 6.15 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications
This versatile PCB is suitable for a range of applications, including:
- High Power Amplifiers
- Miniaturized Antennas
- GPS, Patch, RFID Readers
- Filters, Couplers, and Dividers
- Satellite Components
Quality Assurance and Availability
This PCB is produced in accordance with IPC-Class 2 standards and is available for global shipping. The artwork is supplied in Gerber RS-274-X format, ensuring it is compatible with standard PCB design workflows.
Utilizing RF-60TC material allows you to attain superior performance and reliability in high-frequency applications, making it an ideal option for sophisticated RF circuit designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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