Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 Core - 125mil (3.175mm) |
| Layer count | 2-layer |
| PCB size | 45mm x 70mm=1PCS, +/- 0.15mm |
| PCB thickness | 3.2mm |
| Finished Cu weight | 1oz (1.4 mils) outer layers |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RF-10 Core - 125mil (3.175mm) | Layer count | 2-layer |
| PCB size | 45mm x 70mm=1PCS, +/- 0.15mm | PCB thickness | 3.2mm |
| Finished Cu weight | 1oz (1.4 mils) outer layers | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | Immersion Gold RF-10 PCBs ，Double-Sided Circuits RF-10 PCBs ，125mil RF-10 PCBs | ||
In the fast-evolving world of electronics, revolutionary advancements in RF design are critical. The newly launched RF-10 PCB stands out, engineered for excellence in signal transmission and optimized for high-frequency applications.
Material Composition and Structure
Constructed from advanced RF-10 copper clad laminates, this PCB combines ceramic-filled PTFE with woven fiberglass. This unique composition ensures unmatched performance for high-frequency circuits, paving the way for compact solutions to modern electronic challenges.
Key Features of RF-10 PCBs
The RF-10 PCB boasts a dielectric constant of 10.2 ± 0.3 at 10GHz, allowing for significant size reduction in RF circuit designs. Coupled with a low dissipation factor of 0.0025 at the same frequency, the PCB minimizes signal loss, ensuring reliable and efficient communication.
Performance Benefits for High-Frequency Applications
High thermal conductivity of 0.85 W/mk enhances thermal management, making the RF-10 PCB ideal for applications where reliability is paramount. The low coefficients of thermal expansion (CTE) further ensure dimensional stability, reducing the risk of mechanical failure during operation.
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | V-0 | V-0 |
Technical Specifications Overview
Featuring a 2-layer rigid stackup, the RF-10 PCB includes precise technical specifications that cater to demanding RF applications. With a finished board thickness of 3.2mm and a comprehensive quality assurance process, this PCB is designed for peak performance.
Versatile Applications in Modern Electronics
The versatility of the RF-10 PCB allows for its use in various applications, including microstrip patch antennas, GPS systems, and passive components. It is a game changer for RF applications worldwide, enabling engineers to unlock new potentials in circuit design.
Quality Assurance and Manufacturing Standards
Adhering to IPC-Class-2 standards, the RF-10 PCB undergoes 100% electrical testing prior to shipment. This commitment to quality ensures that every unit meets the high expectations of performance and reliability.
Global Availability and Accessibility
With worldwide availability, the RF-10 PCB is accessible to manufacturers and engineers looking to enhance their RF designs. The industry-compliant delivery times make it a preferred choice for modern electronic applications.
Future Trends in RF Technology
As we look ahead, the RF-10 PCB positions itself at the forefront of RF technology innovation. It embodies the principles of precision engineering and reliability, setting the stage for future advancements in electronic design.
Conclusion: Embracing the Future with RF-10
In conclusion, the RF-10 PCB represents a significant leap forward in high-frequency technology. With its superior features and benefits, it is more than just a product; it is a catalyst for innovation in the RF landscape. Embrace the future of RF design with the unmatched capabilities of the RF-10 PCB.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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