Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
PCB material | RF-60A- 0.635 mm (25mil) |
Layer count | 2-layer |
PCB thickness | 0.7mm |
PCB size | 65mm x 14mm=1PCS, +/- 0.15mm |
Copper weight | 1 oz (1.4 mils) outer layers |
Surface finish | Immersion gold |
Brand Name | Bicheng |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
PCB material | RF-60A- 0.635 mm (25mil) | Layer count | 2-layer |
PCB thickness | 0.7mm | PCB size | 65mm x 14mm=1PCS, +/- 0.15mm |
Copper weight | 1 oz (1.4 mils) outer layers | Surface finish | Immersion gold |
Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
Place of Origin | China | ||
High Light | 2 Layer PCB ,25mil Thick PCB ,RF-60A PCB |
This high-performance PCB is engineered to meet the stringent requirements of a variety of high-frequency applications, ensuring reliability and precision.
Understanding RF-60A Material
The RF-60A is part of Taconic's esteemed ORCER family, known for its exceptional organic-ceramic laminate construction. This material is crafted with woven glass reinforcement, which enhances dimensional stability and flexural strength, making it ideal for demanding electronic applications. The innovative formulation of RF-60A results in low moisture absorption and uniform electrical properties, setting a benchmark for reliability in challenging environments.
Key Properties of RF-60A
The robust characteristics of RF-60A make it a preferred material for high-frequency applications:
- Dielectric Constant (Dk): 6.15 at 10 GHz. This low Dk allows for minimal signal loss and improved performance in RF applications.
- Dissipation Factor: 0.0038 at 10 GHz/23°C. This low dissipation factor ensures efficient signal transmission with reduced heat generation.
- Moisture Absorption: 0.02%. The low moisture absorption rate contributes to enhanced reliability in humid environments.
- Thermal Conductivity: 0.4 W/MK. This property aids in effective heat dissipation, crucial for high-power applications.
- CTE (Coefficient of Thermal Expansion):
- X-axis: 9 ppm/°C
- Y-axis: 8 ppm/°C
- Z-axis: 69 ppm/°C
- Outgassing Properties: 0.02% TML, 0.01% WVR. These characteristics make RF-60A suitable for space-constrained applications.
These properties ensure that the RF-60A PCB maintains performance integrity even under extreme conditions, which is essential for applications in aerospace, telecommunications, and medical devices.
RF-60A Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.6 | 6.15 | 6.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 | 0.0038 | 0.0038 | ||
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 53 | kV | 53 |
Dielectric Strength | ASTM D 149 | V/mil | 880 | kV/mm | 35 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 9.0 x 108 | Mohm/cm | 9.0 x 108 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 2.28 x 108 | Mohm | 2.28 x 108 |
Arc Resistance | IPC-650 2.5.1 | Seconds | 193 | Seconds | 193 |
Flexural Strength (MD) | ASTM D 790 | psi | 18,300 | N/mm2 | 126.2 |
Flexural Strength (CD) | ASTM D 790 | psi | 14,600 | N/mm2 | 100.7 |
Tensile Strength (MD) | ASTM D 3039 | psi | 19,500 | N/mm2 | 134.4 |
Tensile Strength (CD) | ASTM D 3039 | psi | 16,300 | N/mm2 | 112.4 |
Young’s Modulus | ASTM D 3039 | kpsi | 1,590 | N/mm2 | 11,000 |
Poisson’s Ratio | ASTM D 3039 | 0.068 | N/mm2 | 0.068 | |
Compressive Modulus | ASTM D 695 (23°C) | kpsi | 338 | 2,330 | |
Peel Strength (1 oz. ED) | IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) | lbs/in | 8 | N/mm | 1.4 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.68 | mm/M | 0.68 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 1.05 | mm/M | 1.05 |
Density (Specific Gravity) | ASTM D 792 | g/cm3 | 2.79 | g/cm3 | 2.79 |
Thermal Conductivity | ASTM F 433 | W/M*K | 0.4 | W/M*K | 0.4 |
CTE (X axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 9 | ppm/°C | 9 |
CTE (Y axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 8 | ppm/°C | 8 |
CTE (Z axis) | ASTM D 3386 (-30°C - 125°C) | ppm/°C | 69 | ppm/°C | 69 |
Outgassing (% TML) | ASTM E 595* | % | 0.02 | % | 0.02 |
Outgassing (% CVCM) | ASTM E 595* | % | 0.00 | % | 0.00 |
Outgassing (% WVR) | ASTM E 595* | % | 0.01 | % | 0.01 |
Flammability Rating | UL 94 | V-0 | V-0 |
Detailed PCB Specifications
This PCB features a sophisticated 2-layer rigid construction that optimizes performance for high-frequency applications. Below are the precise specifications that define its capabilities:
Technical Specifications
- Base Material: RF-60A
- Layer Count: 2 layers, providing a balance of complexity and efficiency.
- Board Dimensions: 65mm x 14mm (±0.15mm), allowing for compact designs without sacrificing functionality.
- Minimum Trace/Space: 4/6 mils, facilitating intricate circuit designs.
- Minimum Hole Size: 0.3mm, accommodating various electronic components.
- Finished Board Thickness: 0.7mm, ensuring durability and reliability.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, providing robust electrical connections.
- Via Plating Thickness: 20 μm, enhancing the durability of connections between layers.
- Surface Finish: Immersion Gold, ensuring excellent solderability and corrosion resistance.
- Top Silkscreen: Black, providing clear identification for components.
- Top Solder Mask: Blue, contributing to aesthetic and functional design.
- Electrical Testing: 100% tested prior to shipment, ensuring quality assurance.
- Global Availability: Yes, making it accessible for manufacturers worldwide.
PCB Stackup Structure
The stackup of the RF-60A PCB consists of:
- Copper Layer 1: 35 μm, ensuring effective signal transmission.
- RF-60A Dielectric: 0.635 mm (25 mils), providing essential insulation and stability.
- Copper Layer 2: 35 μm, allowing for complex circuit configurations.
This carefully designed configuration ensures optimal performance and reliability, particularly in high-frequency applications.
Applications in Industry
The RF-60A PCB is well-suited for various high-frequency applications, including:
Power Amplifiers: Used in communication systems where signal strength is critical.
Filters and Couplers: Essential for signal processing and routing in RF circuits.
Miniaturized Antennas: Ideal for compact designs in modern communication devices.
Passive Components: Such as capacitors and resistors, where stability and reliability are paramount.
Compliance and Sustainability
The RF-60A PCB adheres to IPC-Class-2 standards, ensuring that it meets high-quality manufacturing benchmarks. Additionally, it is RoHS and WEEE compliant, reflecting a commitment to environmental sustainability and responsible manufacturing practices. This compliance not only ensures safety for end-users but also aligns with global efforts to minimize electronic waste.
Conclusion
With its advanced RF-60A material, high precision, and robust design, the 2-layer rigid PCB is positioned as the perfect solution for your next electronic project. Superior quality and reliability are offered, tailored for high-frequency applications!
For further inquiries or to place an order, please reach out to our dedicated sales team.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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