6-layer Hybrid PCB On 16.6mil RO4350B And High Tg FR-4

Product Specification

Introducing our advanced 6-layer Hybrid PCB, combining the high-frequency capabilities of RO4350B with the mechanical strength of high-Tg FR-4. This PCB is designed for applications requiring exceptional performance and reliability in demanding environments, making it ideal for various high-tech industries.

1. Base Materials:
- RO4350B: Known for its superior high-frequency performance, RO4350B boasts a dielectric constant of 3.48 and a dissipation factor of 0.0037 at 10 GHz. This material is crucial for minimizing signal loss and ensuring high integrity in RF applications.

- High-Tg FR-4: With a glass transition temperature (Tg) of ≥ 170°C, this material provides excellent thermal resistance and mechanical stability, making it suitable for high-temperature soldering processes.

Detailed Specifications

- Layer Count: 6 layers
- Board Dimensions: 155mm x 120mm (± 0.15mm)
- Minimum Trace/Space: 4/6 mils
- Minimum Hole Size: 0.4mm
- Blind Vias: None
- Finished Board Thickness: 1.6mm
- Finished Copper Weight: 1oz (1.4 mils) for outer layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion silver
- Silkscreen: White (Top), None (Bottom)
- Solder Mask: Green (Top and Bottom)
- Quality Assurance: 100% electrical testing prior to shipment

Artwork and Standards

- Type of Artwork Supplied: Gerber RS-274-X
 

- Quality Standard: IPC-Class-2
 

- Availability: Worldwide

Key Advantages of Hybrid PCB

1. Performance Optimization

The combination of RO4350B and high-Tg FR-4 allows for significant performance enhancements:

- Signal Integrity: RO4350B is ideal for high-frequency circuits, such as antennas and RF traces, ensuring minimal signal loss and delay. The FR-

4 material efficiently manages low-frequency and power sections, providing cost efficiency.

- Impedance Control: The tight dielectric constant tolerance of RO4350B (±0.05) enables precise impedance matching, which is critical for high-frequency applications.

2. Thermal Management and Reliability

- High-Temperature Endurance: The high Tg of FR-4 accommodates lead-free soldering processes, while RO4350B’s low coefficient of thermal expansion (CTE) helps reduce thermal stress and the risk of delamination.

- UL 94 V-0 Certification: RO4350B’s flame-retardant properties enhance the overall safety and reliability of the PCB, making it suitable for various demanding applications.

3. Cost and Manufacturing Efficiency

- Selective Material Use: By utilizing RO4350B only in high-frequency areas, manufacturers can optimize material costs without compromising performance.

- Process Compatibility: Both materials are compatible with standard FR-4 processes, including drilling, etching, and lamination, simplifying the manufacturing process and reducing the need for specialized equipment.

Typical Applications

This hybrid PCB is suitable for a wide range of high-tech applications, including:

- Cellular Base Station Antennas and Power Amplifiers**: Ensuring reliable communication in mobile networks.

- RF Identification Tags: Facilitating efficient tracking and identification.

- Automotive Radar and Sensors: Enhancing vehicle safety and navigation systems.

- LNBs for Direct Broadcast Satellites: Delivering high-quality signal reception for satellite communications.

Conclusion

This 6-layer Hybrid PCB with RO4350B and high-Tg FR-4 represents the cutting edge of PCB technology, offering a combination of performance, reliability, and cost-effectiveness. Designed for high-frequency applications, this PCB meets the rigorous demands of modern electronics, ensuring exceptional signal integrity and thermal management.

Investing in our hybrid PCB solutions means choosing quality and innovation that will enhance your electronic designs. For more information or to discuss your specific needs, please contact our sales team. Let us support your projects with our high quality PCB solutions!