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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished
China RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

  1. China RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB Material RF-10 Core - 60mil (1.524mm)
Layer Count 2-layer
PCB Size 64mm x 45.7mm=1PCS, +/- 0.15mm
PCB Thickness 1.524 mm
Copper Weight 1oz (1.4 mils) inner/outer layers
Surface Finish Immersion tin
Solder Mask NO
Silkscreen NO
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
PCB Material RF-10 Core - 60mil (1.524mm) Layer Count 2-layer
PCB Size 64mm x 45.7mm=1PCS, +/- 0.15mm PCB Thickness 1.524 mm
Copper Weight 1oz (1.4 mils) inner/outer layers Surface Finish Immersion tin
Solder Mask NO Silkscreen NO
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin CHINA
High Light RF-10 Immersion Tin Finished PCB1.524mm Immersion Tin Finished PCB60mil Immersion Tin Finished PCB

As the demand for advanced electronic solutions grows, the need for high-quality printed circuit boards (PCBs) has never been more critical. Our newly shipped 2-layer rigid PCB, constructed using RF-10 material, offers exceptional performance tailored for a variety of applications, particularly in the RF sector.

 

1. Technical Specifications

 

PCB Construction

- Base Material: RF-10, a composite of ceramic-filled PTFE and woven fiberglass.
 

- Board Dimensions: 64mm x 45.7mm (± 0.15mm), providing a compact form factor.
 

- Finished Board Thickness: 1.6mm, ensuring durability and robustness.
 

- Finished Copper Weight: 1oz (1.4 mils) for outer layers, supporting efficient signal transmission.
 

- Minimum Trace/Space: 4/6 mils, allowing for high-density designs.
 

- Minimum Hole Size: 0.4mm, accommodating various components.
 

- Via Plating Thickness: 20 μm, ensuring reliable connections.
 

- Surface Finish: Immersion tin, offering excellent solderability and corrosion resistance.
 

- Electrical Testing: Each PCB undergoes a 100% electrical test before shipment to guarantee reliability.

 

PCB Stackup

- Copper Layer 1: 35μm (1oz)
- RF-10 Core: 60mil (1.524mm), providing excellent dielectric properties.
- Copper Layer 2: 35μm (1oz)

 

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0

 

2. Advantages of RF-10 Material

 

High Dielectric Constant

With a dielectric constant of 10.2 ± 0.3 at 10GHz, RF-10 allows for significant size reduction in RF circuits. This feature is crucial for modern devices that need to be both compact and efficient.

 

Low Dissipation Factor

RF-10 boasts a dissipation factor of 0.0025 at 10GHz, minimizing energy loss and enhancing overall circuit performance. This characteristic is vital for high-frequency applications where signal integrity is paramount.

 

Excellent Dimensional Stability

The thin woven fiberglass reinforcement provides improved rigidity and dimensional stability, ensuring that the PCB can endure the stresses of manufacturing and operation without compromising performance.

 

High Thermal Conductivity

With a thermal conductivity of 0.85 W/mk, RF-10 effectively manages heat, making it suitable for high-power applications where thermal management is essential.

 

Flammability Rating

The material is rated V-0 for flammability, adding an extra layer of safety for applications in sensitive environments.

 

 

3. Applications

- Microstrip Patch Antennas: Ideal for wireless communication systems.
 

- GPS Antennas: Ensuring accurate positioning and navigation.
 

- Passive Components: Such as filters, couplers, and power dividers, essential for signal processing.
 

- Aircraft Collision Avoidance Systems: Enhancing safety in aviation.
 

- Satellite Components: Supporting reliable communication in space applications.

 

4. Quality Assurance and Compliance

All our PCBs are manufactured to meet IPC-Class-2 standards, ensuring high quality and reliability. The rigorous 100% electrical testing process provides peace of mind, guaranteeing that each board functions as intended.

 

5. Global Availability

We are proud to offer our 2-layer rigid PCB globally, allowing clients from various sectors to access this state-of-the-art technology. Our commitment to quality and customer satisfaction ensures that you receive a product that meets your exact specifications.

 

Conclusion

In summary, our newly shipped 2-layer rigid PCB with RF-10 material represents a significant advancement in PCB technology. With its impressive specifications, material advantages, and suitability for a wide range of applications, this PCB is poised to meet the demands of today’s electronic landscape.

 

Reach out to us today to learn more about our PCBs or place an order!

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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