Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | TLX-8 |
| Layer count | 2 layers |
| PCB thickness | 0.3mm |
| PCB size | 20mm x 21.35 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) outer layers |
| Solder mask | No |
| Silkscreen | No |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | TLX-8 | Layer count | 2 layers |
| PCB thickness | 0.3mm | PCB size | 20mm x 21.35 mm=1PCS, +/- 0.15mm |
| Copper weight | 1oz (1.4 mils) outer layers | Solder mask | No |
| Silkscreen | No | Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China | ||
| High Light | 2-layer RF PCB board ，ENIG finish PCB ，10mil substrate RF PCB | ||
Introduction to TLX-8 Material
TLX-8 is a high-volume antenna material composed of PTFE fiberglass laminates, specifically designed for reliable performance in a broad range of RF applications. Its versatility comes from various thickness options and copper cladding types, making it ideal for low layer count microwave designs. TLX-8 demonstrates mechanical reinforcement in severe environments, including:
- High vibration during space launches
- High temperature exposure in engine modules
- Radiation resistance for space applications
- Extreme conditions at sea for naval antennas
- Wide temperature ranges for altimeter substrates during flight
PCB Stack-up
The stackup of the PCB consists of:
- Copper Layer 1: 35 μm
- Taconic TLX-8 Core: 0.254 mm (10 mil)
- Copper Layer 2: 35 μm
PCB Details
| Parameter | Specification |
| Base Material | TLX-8 |
| Layer Count | 2 Layers |
| Board Dimensions | 20mm x 21.35mm ± 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test prior to shipment |
Quality Standards and Availability
This PCB adheres to IPC-Class-2 quality standards and is available for purchase worldwide.
Benefits of TLX-8 PCBs
- Excellent PIM Values: Measured below -160 dBc
- Mechanical & Thermal Properties: Outstanding performance in challenging environments
- Low and Stable Dielectric Constant (Dk): Provides consistent electrical performance
- Dimensionally Stable: Maintains form factor under various conditions
- Low Moisture Absorption: Enhances durability and reliability
- Tightly Controlled Dk: Ensures predictable performance
- Low Dissipation Factor (DF): Minimizes signal loss
- UL 94 V0 Rating: High flammability resistance
- Ideal for Low Layer Count Microwave Designs: Perfect for advanced RF applications
Electrical Properties
- Dielectric Constant @ 10 GHz: 2.55 ± 0.04
- Dissipation Factor @ 10 GHz: 0.0018
- Surface Resistivity (Elevated Temp): 6.605 x 10^8 Mohm
- Surface Resistivity (Humidity Conditions): 3.550 x 10^6 Mohm
- Volume Resistivity (Elevated Temp): 1.110 x 10^10 Mohm/cm
- Volume Resistivity (Humidity Conditions): 1.046 x 10^10 Mohm/cm
Dimensional Stability
- MD After Bake: 0.06 mm/M
- CD After Bake: 0.08 mm/M
- MD Thermal Stress: 0.09 mm/M
- CD Thermal Stress: 0.10 mm/M
Coefficient of Thermal Expansion (CTE)
- X: 21 ppm/°C
- Y: 23 ppm/°C
- Z: 215 ppm/°C
Thermal Properties
- 2% Weight Loss: 535 °C
- 5% Weight Loss: 553 °C
Chemical and Physical Properties
- Moisture Absorption: 0.02%
- Dielectric Breakdown: > 45 kV
- Flammability Rating: V-0
Typical Applications
TLX-8 PCBs are suited for various applications, including:
- Radar systems
- Mobile communications
- Microwave test equipment
- Microwave transmission devices
- Couplers, splitters, combiners, amplifiers, and antennas
With its robust construction and exceptional properties, TLX-8 is the material of choice for high-performance PCBs in demanding RF environments.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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