Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | RO3006 |
| Layer count | 2 layers |
| PCB thickness | 0.3mm |
| PCB size | 45.2mm x 43.5mm=1PCS |
| Copper weight | 1oz (1.4 mils) outer layers |
| Solder mask | No |
| Silkscreen | White |
| Surface finish | Immersion Gold |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | RO3006 | Layer count | 2 layers |
| PCB thickness | 0.3mm | PCB size | 45.2mm x 43.5mm=1PCS |
| Copper weight | 1oz (1.4 mils) outer layers | Solder mask | No |
| Silkscreen | White | Surface finish | Immersion Gold |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China | ||
| High Light | RF PCB double-sided laminate ，immersion gold PCB board ，10mil thickness RF PCB | ||
In the dynamic world of electronics, the demand for high-performance printed circuit boards (PCBs) has never been greater. Our 2-layer PCB, constructed from Rogers RO3006, is specifically designed to meet the rigorous requirements of RF and microwave applications.
Material Selection: Rogers RO3006
At the core of this PCB is Rogers RO3006, a state-of-the-art laminate material known for its exceptional electrical and mechanical properties. This ceramic-filled PTFE composite is engineered for commercial microwave and RF applications, offering superior performance and stability.
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Key Features of Rogers RO3006
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz and 23°C, this stable Dk is crucial for maintaining signal integrity in high-frequency applications.
- Dissipation Factor: With a low dissipation factor of 0.002 at 10 GHz, Rogers RO3006 minimizes energy loss, making it ideal for efficient signal transmission.
- Thermal Stability: The thermal decomposition temperature (Td) exceeds 500°C, providing robust performance in demanding thermal environments.
- Moisture Absorption: A remarkably low moisture absorption rate of 0.02% enhances the reliability of the PCB in various environmental conditions.
- Coefficient of Thermal Expansion (CTE): With X and Y axes at 17 ppm/°C and Z axis at 24 ppm/°C, Rogers RO3006 offers excellent dimensional stability.
PCB Specifications
| Parameter | Specification |
| Base Material | RO3006 |
| Layer Count | 2 Layers |
| Board Dimensions | 45.2mm x 43.5mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight | 1 oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
Stackup Configuration
The PCB features a robust stackup designed for optimal electrical performance:
- Copper Layer 1: 35 μm
- Rogers RO3006 Core: 10 mils (0.254mm)
- Copper Layer 2: 35 μm
This configuration ensures effective electrical connections and stable thermal management, critical for high-frequency applications.
Quality Assurance
Each PCB undergoes a 100% electrical test prior to shipment, ensuring compliance with IPC-Class-2 standards. This rigorous testing process is designed to guarantee reliability and performance in demanding environments.
Typical Applications
The versatility of this PCB makes it ideal for various high-frequency applications, including:
- Automotive Radar Applications: Enhancing vehicle safety and navigation systems.
- Global Positioning Satellite (GPS) Antennas: Ensuring precise location tracking with minimal signal loss.
- Cellular Telecommunications Systems: Perfect for power amplifiers and antennas, supporting reliable communication.
- Patch Antennas for Wireless Communications: Supporting seamless connectivity for mobile devices.
- Direct Broadcast Satellites: Delivering high-quality satellite signals for entertainment and communications.
- Datalink on Cable Systems: Facilitating efficient data transmission for cable networks.
- Remote Meter Readers: Enhancing utility management with reliable data collection.
- Power Backplanes: Supporting high-performance power distribution in complex systems.
Conclusion
This 2-layer PCB featuring Rogers RO3006 material represents the forefront of PCB technology, offering exceptional performance, reliability, and versatility.
Investing in this advanced PCB solution not only ensures that your products meet the demands of modern technology but also positions them for success in an increasingly competitive market. To learn more or to place an order, please contact us today—let’s take your electronic solutions to the next level!
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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