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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias
China 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

  1. China 3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

3-Layer RO4003C PCB 1.8mm Thick with Blind Vias

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99/PCS
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
PCB material RO4003C /RO4450F
Layer count 3 layers
PCB thickness 1.82mm
PCB size 291mm x 155 mm=2 Types=2PCS, +/- 0.15mm
Copper weight 1oz (1.4 mils) outer layers / 1oz inner layers
Solder mask Black
Silkscreen White
Surface finish Immersion Gold
Brand Name Bicheng
Certification UL, ISO9001, IATF16949
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
PCB material RO4003C /RO4450F Layer count 3 layers
PCB thickness 1.82mm PCB size 291mm x 155 mm=2 Types=2PCS, +/- 0.15mm
Copper weight 1oz (1.4 mils) outer layers / 1oz inner layers Solder mask Black
Silkscreen White Surface finish Immersion Gold
Brand Name Bicheng Certification UL, ISO9001, IATF16949
Place of Origin China
High Light 3-layer Rogers RO4003C PCB1.8mm thick RO4003C PCBBlind vias Rogers PCB board

This PCB is a high-performance 3-layer printed circuit board made from advanced materials, specifically RO4003C and RO4450F. It is designed for precision and reliability, meeting stringent specifications to ensure optimal electrical performance and mechanical stability.

 

PCB details

Parameter Specification
Base Material RO4003C / RO4450F
Layer Count 3 Layers
Board Dimensions 291mm x 155mm ± 0.15mm (2 Types, 2 PCS)
Minimum Trace/Space 5/4 mils
Minimum Hole Size 0.3mm
Blind Vias Top Layer to Inner Layer 1
Finished Board Thickness 1.82mm
Finished Cu Weight 1oz (1.4 mils) outer layers / 1oz inner layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No
Top Solder Mask Black
Bottom Solder Mask No
Electrical Testing 100% electrical test used prior to shipment

 

The stack-up of this 3-layer rigid PCB is structured as follows:

 

- Copper Layer 1: 35 μm

-Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 2: 35 μm

- Bonding Ply: RO4450F - 0.102 mm (4 mil)

- Rogers 4003C Core: 0.813 mm (32 mil)

- Copper Layer 3: 35 μm

 

 

Artwork and Quality Standards

The artwork supplied is in the Gerber RS-274-X format, adhering to IPC-Class-2 quality standards. This ensures that the PCB meets industry requirements for reliability and performance.

 

Global Availability

This high-performance PCB is available worldwide, making it accessible for various applications across different markets.

 

Introduction to RO4003C

Rogers RO4003C is a proprietary material known for its excellent electrical performance. It combines the benefits of PTFE/woven glass with the manufacturability of epoxy/glass, offering a cost-effective solution for microwave laminates. Key features include:

 

- Dielectric Constant (Dk): 3.38 ±0.05 at 10GHz

- Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz

- Thermal Coefficient of Dielectric Constant: +40 ppm/°C

- Thermal Conductivity: 0.71 W/m/°K

- Low Moisture Absorption: 0.06%

 

The material's thermal expansion characteristics align closely with copper, facilitating reliable plated through-hole quality.

 

Benefits

Rogers RO4003C offers numerous benefits, including:

- Ideal for multi-layer board constructions

- Lower fabrication costs compared to standard materials like FR-4

- Designed for performance-sensitive, high-volume applications

- Competitively priced, making it a popular choice

 

Typical Applications

RO4003C PCB is suitable for various applications, including:

 

- Cellular base station antennas and power amplifiers

- RF identification tags

- Automotive radar and sensors

- LNBs for direct broadcast satellites

 

Conclusion

The 3-layer PCB constructed with RO4003C and RO4450F materials exemplifies advanced engineering and design, making it ideal for demanding applications in telecommunications, automotive, and aerospace industries. Its combination of high performance, cost-effectiveness, and reliability ensures it meets the needs of modern electronics.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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Get in touch with us

  • Reach Us
  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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