Product Specification

High-purity semi-insulating silicon carbide (SiC) substrates are specialized materials made from silicon carbide, widely used in the manufacturing of power electronics, radio frequency (RF) devices, and high-frequency, high-temperature semiconductor components. Silicon carbide, as a wide-bandgap semiconductor material, offers excellent electrical, thermal, and mechanical properties, making it highly suitable for applications in high-voltage, high-frequency, and high-temperature environments.

Here is a detailed introduction to high-purity semi-insulating SiC substrates:

Material Characteristics of  Semi-Insulating Silicon Carbide (SiC)

• Semi-Insulating Properties: High-purity semi-insulating SiC substrates are fabricated through precise doping techniques, which results in a very low electrical conductivity, giving them a high resistivity at room temperature. This semi-insulating characteristic allows them to effectively isolate different regions in electronic applications, minimizing electrical interference and making them ideal for high-power, high-frequency, and high-voltage devices.

• High Thermal Conductivity: Silicon carbide has a thermal conductivity of approximately 4.9 W/cm·K, much higher than that of silicon, which allows for better heat dissipation. This is crucial for power devices that operate at high power densities, reducing the risk of device failure due to overheating.

• Wide Bandgap: SiC has a wide bandgap of 3.26 eV, compared to silicon’s 1.1 eV, making it more capable of handling higher voltages and currents, and able to operate at high frequencies and high powers. This enables SiC devices to function in environments that would typically cause conventional silicon-based devices to fail.

• Chemical Stability: SiC exhibits excellent chemical stability, making it resistant to high-temperature, high-humidity, and acid-base environments, thereby enhancing the longevity of components in harsh conditions.

• High Mechanical Strength: SiC is known for its hardness and high mechanical strength, making it resilient to physical damage. This property makes it suitable for high-power applications, where mechanical robustness is critical.

Primary Application Areas

• Power Electronics: Due to its excellent high-temperature and high-voltage capabilities, high-purity semi-insulating SiC substrates are widely used in power semiconductor devices such as MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), IGBTs (Insulated-Gate Bipolar Transistors), SBDs (Schottky Barrier Diodes), etc. These devices are commonly found in power conversion systems, electric vehicles, inverters, solar power systems, and more.

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• Radio Frequency (RF) Devices: SiC substrates are ideal for high-frequency, high-power applications such as RF amplifiers, radar systems, and communication equipment, offering strong signal processing capabilities and stability.

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• High-Temperature and High-Pressure Applications: The robustness of SiC allows it to perform well in extreme environments, including aerospace, automotive, and military applications, where high temperatures, high pressures, and high powers are prevalent.

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• Optoelectronic Devices: SiC substrates are used in ultraviolet light detectors, lasers, and other optoelectronic devices due to their strong response to ultraviolet light, making them suitable for environmental monitoring, military, and medical applications.

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• Electric Vehicles (EVs) and New Energy Vehicles: As electric vehicles continue to grow, high-purity semi-insulating SiC substrates play an increasingly important role in battery management systems, power conversion systems, and other high-power applications in the automotive industry.

Advantages

• High Efficiency and Low Loss: High-purity semi-insulating SiC substrates offer low conduction losses and high current handling capabilities, improving the efficiency of power devices and reducing energy waste, making them ideal for high-power applications.

• Wide Operating Temperature Range: SiC devices can operate in higher temperature environments compared to silicon devices, which is crucial for maintaining stable performance in harsh operating conditions.

• Durability and Reliability: SiC substrates are highly resistant to high temperatures, corrosion, and wear, contributing to the long-term stability and reliability of devices that use them. This makes them particularly valuable in mission-critical applications where failure is not an option.

Manufacturing Process

• Crystal Growth: High-purity semi-insulating SiC substrates are grown using methods such as Chemical Vapor Deposition (CVD) or Physical Vapor Transport (PVT), ensuring high-quality crystals with minimal defects to meet the stringent requirements of power semiconductor devices.

• Doping Control: Doping techniques (e.g., aluminum or nitrogen doping) are carefully controlled to achieve the desired semi-insulating characteristics, with precise adjustments to resistivity and electrical properties. This process requires advanced technology and tight process control to ensure optimal substrate performance.

• Surface Treatment: After growth, the SiC substrates undergo stringent surface polishing and cleaning to eliminate defects and reduce surface charge density, enhancing the performance and reliability of the final device.

Market Outlook

The demand for high-purity semi-insulating SiC substrates is steadily increasing due to the growing adoption of electric vehicles, smart grids, renewable energy (such as solar and wind power), and high-efficiency power electronics. As SiC substrate manufacturing techniques continue to improve and the demand for power-efficient devices rises, the SiC substrate market is expected to expand significantly. In the future, SiC substrates will become even more crucial in power electronics and related technologies.

Challenges and Future Development

• Cost Control: The production cost of SiC substrates remains relatively high, especially for large-diameter substrates. Ongoing optimization of manufacturing processes will be essential to lower costs and increase the accessibility of SiC-based devices.

• Scalability: While SiC substrates are already being used in many applications, scaling up production to meet global demand, especially for larger substrates, remains a challenge. Continued advancements in substrate growth techniques and production methods will be critical for addressing this.

• Technological Advancements: As SiC technologies mature, there will be improvements in substrate quality, yield rates, and device performance. New developments will expand the use of SiC substrates into additional industries and applications, further driving their market adoption.