Delivery Time | 2 weeks |
Payment Terms | 100%T/T |
Supply Ability | |
EPD | ≤1E10/cm2 |
Thickness | 600±50μm |
Particle | Free/Low Particle |
Edge Exclusion | ≤50um |
Surface Finish | Single/Double Side Polished |
Type | 3C-N |
Resistivity | High/Low Resistivity |
Diameter | 2inch 4inch 6inch 8inch |
Brand Name | ZMSH |
Model Number | Silicon carbide wafer |
Place of Origin | China |
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Product Specification
Delivery Time | 2 weeks | Payment Terms | 100%T/T |
Supply Ability | EPD | ≤1E10/cm2 | |
Thickness | 600±50μm | Particle | Free/Low Particle |
Edge Exclusion | ≤50um | Surface Finish | Single/Double Side Polished |
Type | 3C-N | Resistivity | High/Low Resistivity |
Diameter | 2inch 4inch 6inch 8inch | Brand Name | ZMSH |
Model Number | Silicon carbide wafer | Place of Origin | China |
High Light | 8inch Silicon Carbide DSP ,4inch Silicon Carbide DSP ,6inch Silicon Carbide DSP |
2inch 4inch 6inch 8inch 3C-N SiC Wafer Silicon Carbide Optoelectronic High-Power RF LEDS
Compared to 4H-Sic, although the bandgap of 3C silicon carbide
(3C SiC) is lower, its carrier mobility, and thermal conductivity. and mechanical properties are better than those of 4H-SiC. Moreover, the defect density at the interface between the insulating oxide qate and 3C-sic is lower. which is more conducive to manufacturing high-voltage, highly reliable, and long-life devices. At present, 3C-SiC-based devices are mainly prepared on si substrates with large lattice mismatch and thermal expansion coefficient mismatch between Si and 3C SiC resulting in a high defect density, which affects the performance of devices. Moreover, low-cost 3C-SiC wafers will have a significant substitution impact on the power device market in the 600v-1200vvoltage range, accelerating the entire industry's progress. Therefore, developing bulk 3C-SiC wafers is inevitable.
1. Crystal Structure: 3C-SiC has a cubic crystal structure, unlike the more common hexagonal 4H-SiC and 6H-SiC polytypes. This cubic structure offers some advantages in certain applications.
2. Bandgap: The bandgap of 3C-SiC is around 2.2 eV, making it suitable for applications in optoelectronics and high-temperature electronics.
3. Thermal Conductivity: 3C-SiC has high thermal conductivity, which is important for applications requiring efficient heat dissipation.
4. Compatibility: It is compatible with the standard silicon processing technologies, enabling its integration with existing silicon-based devices.
Propery | N-type 3C-SiC, Single Crystal |
Lattice Parameters | a=4.349 Å |
Stacking Sequence | ABC |
Mohs Hardness | ≈9.2 |
Therm. Expansion Coefficient | 3.8×10-6/K |
Dielectrc Constant | c~9.66 |
Band-Gap | 2.36 eV |
Break-Down Electrical Field | 2-5×106V/cm |
Saturation Drift Velocity | 2.7×107m/s |
Grade | Zero MPD Production Grade (Z Grade) | Standard Production Grade (P Grade) | Dummy Grade (D Grade) |
Diameter | 145.5 mm~150.0 mm | ||
Thickness | 350 μm ± 25 μm | ||
Wafer Orientation | Off axis: 2.0°-4.0°toward [1120] ± 0.5° for 4H/6H-P, On axis:〈111〉± 0.5° for 3C-N | ||
Micropipe Density | 0 cm-2 | ||
Resistivity | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |
Primary Flat Orientation | {110} ± 5.0° | ||
Primary Flat Length | 32.5 mm ± 2.0 mm | ||
Secondary Flat Length | 18.0 mm ± 2.0 mm | ||
Secondary Flat Orientation | Silicon face up: 90° CW. from Prime flat ± 5.0° | ||
Edge Exclusion | 3 mm | 6 mm | |
LTV/TTV/Bow /Warp | ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |
Roughness | Polish Ra≤1 nm | ||
CMP Ra≤0.2 nm | Ra≤0.5 nm | ||
Edge Cracks By High Intensity Light | None | Cumulative length ≤ 10 mm, single length≤2 mm | |
Hex Plates By High Intensity Light | Cumulative area ≤0.05% | Cumulative area ≤0.1% | |
Polytype Areas By High Intensity Light | None | Cumulative area≤3% | |
Visual Carbon Inclusions | Cumulative area ≤0.05% | Cumulative area ≤3% | |
Silicon Surface Scratches By High Intensity Light | None | Cumulative length≤1×wafer diameter | |
Edge Chips High By Intensity Light | None permitted ≥0.2mm width and depth | 5 allowed, ≤1 mm each | |
Silicon Surface Contamination By High Intensity | None | ||
Packaging | Multi-wafer Cassette or Single Wafer Container |
1. Power Electronics: 3C-SiC wafers are used in high-power electronic devices such as MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) and Schottky diodes due to their high breakdown voltage, high thermal conductivity, and low on-resistance.
2. RF and Microwave Devices: The high electron mobility and superior thermal conductivity of 3C-SiC make it suitable for applications in radio frequency (RF) and microwave devices like high-power amplifiers and high-frequency transistors.
3. Optoelectronics: 3C-SiC wafers are used in the development of optoelectronic devices such as light-emitting diodes (LEDs), photodetectors, and laser diodes due to their wide bandgap and excellent thermal properties.
4. MEMS and NEMS Devices: Micro-electro-mechanical systems (MEMS) and nano-electro-mechanical systems (NEMS) benefit from 3C-SiC wafers for their mechanical stability, high-temperature operation capability, and chemical inertness.
5. Sensors: 3C-SiC wafers are utilized in the production of sensors for harsh environments, such as high-temperature sensors, pressure sensors, gas sensors, and chemical sensors, due to their robustness and stability.
6. Power Grid Systems: In power distribution and transmission systems, 3C-SiC wafers are employed in high-voltage devices and components for efficient power conversion and reduced energy losses.
7. Aerospace and Defense: The high-temperature tolerance and radiation hardness of 3C-SiC make it suitable for aerospace and defense applications, including in aircraft components, radar systems, and communication devices.
8. Energy Storage: 3C-SiC wafers are used in energy storage applications like batteries and supercapacitors due to their high thermal conductivity and stability in harsh operating conditions.
Semiconductor Industry: 3C-SiC wafers are also used in the semiconductor industry for the development of advanced integrated circuits and high-performance electronic components.
1.Q:What's the difference between 4H and 3C silicon carbide?
A:Compared to 4H-SiC, although the bandgap of 3C silicon carbide (3C SiC) is lower, its carrier mobility, thermal conductivity, and mechanical properties are better than those of 4H-SiC
2.Q:What is the electron affinity of 3C SiC?
A:The electron affinities of the 3C, 6H and 4H SIC (0001) are 3.8eV, 3.3eV and 3.1eV, respectively.
1. SiC Silicon Carbide Wafer 4H - N Type For MOS Device 2inch Dia50.6mm
2. 6inch SiC Wafer 4H/6H-P RF Microwave LED Lasers
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification:
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op...
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