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Hefei Purple Horn E-Commerce Co., Ltd.

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China TO247 3 packaged Silicon Carbide FET onsemi UF3C065080K3S ideal for replacing Si
China TO247 3 packaged Silicon Carbide FET onsemi UF3C065080K3S ideal for replacing Si

  1. China TO247 3 packaged Silicon Carbide FET onsemi UF3C065080K3S ideal for replacing Si

TO247 3 packaged Silicon Carbide FET onsemi UF3C065080K3S ideal for replacing Si

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Description TO-247-3 JFETs RoHS
Mfr. Part # UF3C065080K3S
Package TO-247-3
Model Number UF3C065080K3S

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  1. Product Details
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Product Specification

Description TO-247-3 JFETs RoHS Mfr. Part # UF3C065080K3S
Package TO-247-3 Model Number UF3C065080K3S

Product Overview

This Silicon Carbide (SiC) FET device utilizes a unique cascode configuration, integrating a normally-on SiC JFET with a Si MOSFET to create a normally-off SiC FET. Its standard gate-drive characteristics enable it to serve as a direct replacement for Si IGBTs, Si FETs, SiC MOSFETs, and Si superjunction devices. Available in a TO247-3 package, this device offers ultra-low gate charge and exceptional reverse recovery, making it ideal for switching inductive loads with recommended RC-snubbers and applications requiring standard gate drive.

Product Attributes

  • Brand: onsemi
  • Material: Silicon Carbide (SiC)
  • Package: TO247-3
  • Certifications: Pb-Free, Halogen Free, RoHS Compliant

Technical Specifications

ParameterSymbolTest ConditionsValueUnit
Maximum Ratings
Drain-source VoltageVDS650V
Gate-source VoltageVGSDC-25 to +25V
Continuous Drain Current (Note 1)IDTC = 25 C31A
Continuous Drain Current (Note 1)IDTC = 100 C23A
Pulsed Drain Current (Note 2)IDMTC = 25 C65A
Single Pulsed Avalanche Energy (Note 3)EASL= 15 mH, IAS = 2.1 A33mJ
Power DissipationPtotTC = 25 C190W
Maximum Junction TemperatureTJ,max175C
Operating and Storage TemperatureTJ, TSTG-55 to 175C
Max. Lead Temperature for Soldering, 1/8 from Case for 5 SecondsTL250C
Thermal Characteristics
Thermal Resistance, Junction-to-CaseR JC0.61 - 0.79C/W
Electrical Characteristics (TJ = +25 C unless otherwise specified)
Drain-source Breakdown VoltageBVDSVGS = 0 V, ID = 1 mA650V
Total Drain Leakage CurrentIDSSVDS = 650 V, VGS = 0 V, TJ = 25 C6 - 100A
Total Drain Leakage CurrentIDSSVDS = 650 V, VGS = 0 V, TJ = 175 C40A
Total Gate Leakage CurrentIGSSVDS = 0 V, TJ = 25 C, VGS = -20 V / +20 V20A
Drain-source On-resistanceRDS(on)VGS = 12 V, ID = 20 A, TJ = 25 C80 - 100m
Drain-source On-resistanceRDS(on)VGS = 12 V, ID = 20 A, TJ = 125 C111m
Drain-source On-resistanceRDS(on)VGS = 12 V, ID = 20 A, TJ = 175 C141m
Gate Threshold VoltageVG(th)VDS = 5 V, ID = 10 mA4 - 6V
Gate ResistanceRGf = 1 MHz, open drain4.5
Reverse Diode
Diode Continuous Forward Current (Note 4)ISTC = 25 C31A
Diode Pulse Current (Note 5)IS,pulseTC = 25 C65A
Forward VoltageVFSDVGS = 0 V, IS = 10 A, TJ = 25 C1.5 - 2V
Forward VoltageVFSDVGS = 0 V, IS = 10 A, TJ = 175 C1.75V
Reverse Recovery ChargeQrrVDS = 400 V, IS = 20 A, VGS = -5 V, RG_EXT = 10 ,di/dt = 2200 A/ s, TJ = 25 C119nC
Reverse Recovery TimetrrVDS = 400 V, IS = 20 A, VGS = -5 V, RG_EXT = 10 , di/dt = 2200 A/ s, TJ = 25 C16ns
Reverse Recovery ChargeQrrVDS = 400 V, IS = 20 A, VGS = -5 V, RG_EXT = 10 , di/dt = 2200 A/ s, TJ = 150 C73nC
Reverse Recovery TimetrrVDS = 400 V, IS = 20 A, VGS = -5 V, RG_EXT = 10 , di/dt = 2200 A/ s, TJ = 150 C11ns
Dynamic Performance
Input CapacitanceCissVDS = 100 V, VGS = 0 V, f = 100 kHz1500pF
Output CapacitanceCoss104pF
Reverse Transfer CapacitanceCrss2.6pF
Effective Output Capacitance, Energy RelatedCoss(er)VDS = 0 V to 400 V, VGS = 0 V77pF
Effective Output Capacitance, Time RelatedCoss(tr)VDS = 0 V to 400 V, VGS = 0 V176pF
COSS Stored EnergyEossVDS = 400 V, VGS = 0 V6.2J
Total Gate ChargeQGVDS = 400 V, ID = 20 A, VGS = -5 V to15 V51nC
Gate-drain ChargeQGD11
Gate-source ChargeQGS19
Turn-on Delay Timetd(on)VDS = 400 V, ID = 20 A, Gate Driver = -5 V to +15 V, Turn-on RG,EXT = 1 , Turn-off RG,EXT = 22 , Inductive Load, FWD: same device with VGS = -5 V and RG = 22 , RC snubber: RS = 5 , CS = 100 pF, TJ = 25 C25ns
Rise Timetr14ns
Turn-off Delay Timetd(off)54ns
Fall Timetf11ns
Turn-on Energy Including RS Energy (Note 6)EON182J
Turn-off Energy Including RS Energy (Note 6)EOFF24J
Total Switching Energy Including RS Energy (Note 6)ETOTAL206J
Snubber RS Energy During Turn-onERS_ON0.6J
Snubber RS Energy During Turn-offERS_OFF1.1J
Turn-on Delay Timetd(on)VDS = 400 V, ID = 20 A, Gate Driver = -5 V to +15 V, Turn-on RG,EXT = 1 , Turn-off RG,EXT = 22 , Inductive Load, FWD: same device with VGS = -5 V and RG = 22 , RC snubber: RS = 5 , CS = 100 pF, TJ = 150 C22ns
Rise Timetr14ns
Turn-off Delay Timetd(off)55ns
Fall Timetf12ns
Turn-on Energy Including RS Energy (Note 6)EON156J
Turn-off Energy Including RS Energy (Note 6)EOFF25J
Total Switching Energy Including RS Energy (Note 6)ETOTAL181J
Snubber RS Energy During Turn-onERS_ON0.6J
Snubber RS Energy During Turn-offERS_OFF1.2J

2511111607_onsemi-UF3C065080K3S_C45082712.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

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  • Hefei Purple Horn E-Commerce Co., Ltd.
  • Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
  • https://www.semiconductoric.com/

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