| Reverse Leakage Current (Ir) | 5uA |
| Non-Repetitive Peak Forward Surge Current | 30A |
| Reverse Recovery Time (trr) | 75ns |
| Operating Junction Temperature Range | -55℃~+150℃ |
| Voltage - DC Reverse (Vr) (Max) | 1kV |
| Voltage - Forward(Vf@If) | 1.7V@1.0A |
| Current - Rectified | 1A |
| Description | 30A 75ns 1kV 1.7V@1.0A 1A SMA Single Diodes RoHS |
| Mfr. Part # | US1M-13-F-CN |
| Package | SMA |
| Model Number | US1M-13-F-CN |
View Detail Information
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Product Specification
| Reverse Leakage Current (Ir) | 5uA | Non-Repetitive Peak Forward Surge Current | 30A |
| Reverse Recovery Time (trr) | 75ns | Operating Junction Temperature Range | -55℃~+150℃ |
| Voltage - DC Reverse (Vr) (Max) | 1kV | Voltage - Forward(Vf@If) | 1.7V@1.0A |
| Current - Rectified | 1A | Description | 30A 75ns 1kV 1.7V@1.0A 1A SMA Single Diodes RoHS |
| Mfr. Part # | US1M-13-F-CN | Package | SMA |
| Model Number | US1M-13-F-CN |
| Symbol | Unit | Parameter | Value |
|---|---|---|---|
| VRRM | V | Maximum repetitive peak reverse voltage | 55 to +150 |
| VRMS | V | Maximum RMS voltage | 35 |
| VDC | V | Maximum DC blocking voltage | 30.0 |
| I(AV) | A | Maximum average forward rectified current at TL=100C | 1.0 |
| IFSM | A | Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | 30.0 |
| VF | V | Maximum instantaneous forward voltage at 1.0A | 1.0 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage (TA=25C) | 0.0023 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage (TA=125C) | 0.07 |
| CJ | pF | Typical junction capacitance (Note 2) | 20.0 |
| RqJA | C/W | Typical thermal resistance | 80.0 |
| TJ,TSTG | C | Operating junction and storage temperature range | -55 to +150 |
| Trr | ns | Maximum reverse recovery time (Note 1) | 7.5 |
| Weight | ounce / grams | Weight | 0.0023 / 0.07 |
Note 1: Reverse recovery time test condition: IF=0.5A, IR=1.0A, Irr=0.25A
Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Capacitive Load Current Derating: Derate by 20% for capacitive load.
High Temperature Soldering: Guaranteed 250C/10 seconds at terminals.
Mechanical Data Dimensions (inches and millimeters):
Suggested Pad Layout Dimensions (mm / inch):
Suggested Soldering Temperature Profile: The device can be exposed to a maximum temperature of 265C for 10 seconds. Recommended reflow methods include IR, vapor phase oven, hot air oven, wave solder. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Package Information:
| Carrier Dimension (mm) | A0 | B0 | K0 | D0 | E | F | P0 | P1 | P2 | T | W |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Value | 2.80 | 4.0 | 5.30 | 4.0 | 2.36 | 2.0 | 1.55 | 0.25 | 1.75 | 5.50 | 0.1 |
Package Specifications:
| Package | Reel Size | QTY/Reel | Box Size (mm) | QTY/Box (Kpcs) | Carton Size (mm) | QTY/Carton (Kpcs) | Reel DIA. (mm) |
|---|---|---|---|---|---|---|---|
| SMA | 11' | 5 | 285*10*355 | 310 | 310*310*310 | 80 | 278 |
NOTICE: The information presented in this document is for reference only. ChipNobo reserves the right to adjust product indicators and upgrade some technical parameters for product optimization and productivity improvement. ChipNobo is entitled to be exempted from liability for any delay or non-delivery of the information disclosure process. The product listed herein is designed to be used with residential and commercial equipment, and does not support sensitive items and specialized equipment in areas where sanctions do exist. ChipNobo Co., Ltd or anyone on its behalf, assumes no responsibility or liability for any damages resulting from improper use.
For additional information, please visit our website http://www.chipnobo.com, or consult your nearest Chipnobo sales office for further assistance.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
300~500
Ecer Certification:
Verified Supplier
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