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{"title":"HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0","imgUrl":"https:\/\/img.chinax.com\/nimg\/33\/6c\/2967e8b1e2ec19f03357781a6d00-200x200-1\/hn_8820_potting_gel_7c_1_3a1_mix_ratio_7c_high_thermal_conductivity_7c_ul94_v_0.jpg","attrs":{"Brand Name":"Hanast","Model Number":"HN-8820A\/B","Certification":"FDA\/ROHS\/REACH","Place of Origin":"Guangdong, China"}}
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Thermally Conductive Silicone Encapsulant 2.0W/m·K UL94 V-0 Potting Gel for Motor Drive BMS RF Module Protection
Product Overview
HN-8820 is a thermally conductive two-component silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. With 2.0 W/m·K thermal conductivity, UL 94 V-0 self-extinguishing flame rating, and excellent adhesion to most substrates, this potting gel is engineered for motor drives, battery management systems (BMS), RF modules, and consumer electronics. The 1:1 mix ratio and solvent-free formulation ensure simple, reliable processing with outstanding thermal cycling resistance from -40°C to 150°C.
Performance Highlights
2.0 W/m·K Thermal Conductivity
High-density formulation (2.36 g/cm³) efficiently transfers heat away from power semiconductors in motor drives and BMS modules
UL 94 V-0 Self-Extinguishing
Critical fire safety compliance for industrial motor drives, automotive BMS, and consumer electronics
Excellent Substrate Adhesion
Bonds reliably to PCB, aluminum, copper, and most electronic housing materials without primer — eliminates delamination failure modes
Thermal Cycling Resistance
Remains elastic through repeated -40°C to 150°C temperature swings without cracking or losing adhesion
Solvent-Free & Low Outgassing
Addition-cure chemistry releases no solvents or by-products — safe for sealed electronic enclosures
1:1 Mix Ratio
Compatible with manual mixing and automated meter-mix dispensing systems
Flexible & Repairable
Remains elastic for stress relief and can be removed for component rework when needed
Applications
Motor Drives
Industrial VFD, servo drive, and motor controller power stage potting. 2.0 W/m·K thermal conductivity plus excellent adhesion prevents hot spots and delamination in high-vibration motor drive environments.
Battery Management Systems
BMS module encapsulation for EV, ESS, and industrial battery packs. Provides thermal management, electrical isolation, and flame-retardant protection for cell monitoring and balancing circuitry.
RF Modules & Communication
Potting for RF power amplifiers, antenna tuners, and wireless communication modules. Low dielectric constant formulation minimizes signal loss while protecting sensitive RF components.
Consumer Electronics
Power adapter, charger, and smart home device encapsulation. UL 94 V-0 safety compliance with solvent-free formulation for consumer product safety certifications.
Automotive Control Modules
ECU, TCU, and body control module potting with combined thermal management, vibration damping, and moisture protection for under-hood and cabin electronics.
Power Semiconductors
IGBT, MOSFET, and SiC power module encapsulation. High thermal conductivity formula handles high power density with reliable long-term adhesion under thermal cycling.
Bulk Supply & Quality Assurance
As a direct silicone encapsulant manufacturer with 40,000 sqm production facilities in Shenzhen, China, we provide competitive factory-direct pricing with ISO 9001 certified quality and 100 Tons/month capacity. 1KG MOQ for samples with complete TDS, MSDS, RoHS, and REACH documentation. Custom formulation available for density, adhesion, and cure profile optimization.
