Transparent Electronic Silicone Gel 1:1 IP68 Waterproof Dustproof for LED

Product Specification

Transparent Electronic Silicone Gel for LED Display Driver Encapsulation

The HN-6607A/B is a two-component, addition-cure transparent electronic silicone gel featuring a convenient 1:1 mix ratio. Specially formulated for LED display driver encapsulation and outdoor electronic protection, it delivers exceptional optical clarity (≥90% light transmittance) combined with IP68-rated waterproof and dustproof sealing. After curing, the gel remains flexible and stress-absorbing, protecting sensitive electronic components from vibration, thermal shock, and environmental contamination.

Key Features

• Superior Optical Clarity: ≥90% light transmittance enables visual inspection of encapsulated components without disassembly, ideal for LED display modules and optoelectronic devices requiring optical access.
• IP68 Waterproof Protection: Forms a seamless, void-free seal that withstands prolonged immersion and harsh outdoor conditions, ensuring long-term reliability for outdoor LED drivers, street lighting controls, and signage power supplies.
• 1:1 Convenient Mix Ratio: Simple 1:1 by weight mixing eliminates measurement errors, compatible with both manual dispensing and automated potting equipment for high-volume production lines.
• Low-Stress Flexible Cure: Shore A 15-25 hardness after curing delivers excellent vibration dampening and thermal expansion absorption, preventing wire bond fatigue and solder joint failure in sensitive PCBs.
• Wide Operating Temperature Range: Maintains stable electrical and mechanical properties from -60°C to +200°C, suitable for extreme climate deployment from Middle Eastern deserts to Nordic winters.
• High Dielectric Strength: ≥18 kV/mm electrical insulation protects against short circuits and leakage currents in high-voltage LED driver circuits.

Application Areas

LED Display Drivers & Power Supplies

Primary application for outdoor LED display driver modules, LED power supply units, and LED control boards. The transparent gel allows post-encapsulation optical inspection of driver ICs and solder joints while providing IP68 waterproof sealing against rain, humidity, and dust ingress.

Outdoor Electronic Protection

Ideal for outdoor lighting controllers, street lamp drivers, landscape lighting power modules, and digital signage electronics exposed to harsh weather. The flexible gel absorbs thermal cycling stress without cracking or delamination.

Optoelectronic Devices

Suitable for encapsulating optical sensors, photodiode arrays, LED matrix displays, and fiber optic termination boxes where light transmission through the encapsulant is a critical requirement.

General Electronic PCB Encapsulation

Used for waterproofing and protecting industrial sensor boards, IoT outdoor modules, security camera power boards, and telecommunications equipment requiring visual serviceability after potting.

Processing Guidelines

• Mixing: Combine Part A and Part B at 1:1 weight ratio. Mix thoroughly for 2-3 minutes until uniform. Vacuum degassing at -0.1 MPa for 3-5 minutes is recommended for bubble-free results.
• Pot Life: Approximately 40-60 minutes at 25°C after mixing. Plan dispensing operations within this window.
• Curing: Room temperature cure: 4-6 hours at 25°C. Accelerated cure: 30-60 minutes at 60-80°C for production efficiency.
• Cure Inhibition Warning: This addition-cure system is sensitive to catalyst poisons. Avoid contact with sulfur-containing compounds, amine-cured epoxies, tin-catalyzed silicones, and certain PVC plasticizers. Clean all mixing and dispensing equipment thoroughly before use.

Packaging & Supply

Available in 20kg drum kits and 200kg drum kits. Each shipment includes comprehensive MSDS (Material Safety Data Sheet) and TDS (Technical Data Sheet) documentation. Custom packaging and private labeling options available for OEM partners. Our Shenzhen-based 40,000m² production facility ensures consistent quality and reliable delivery schedules for bulk orders.

Contact our technical team for custom formulations tailored to your specific LED driver encapsulation requirements, including adjusted viscosity, faster cure profiles, and enhanced thermal conductivity options.