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{"title":"HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0","imgUrl":"https:\/\/img.chinax.com\/nimg\/33\/6c\/2967e8b1e2ec19f03357781a6d00-200x200-1\/hn_8820_potting_gel_7c_1_3a1_mix_ratio_7c_high_thermal_conductivity_7c_ul94_v_0.jpg","attrs":{"Brand Name":"Hanast","Model Number":"HN-8820A\/B","Certification":"FDA\/ROHS\/REACH","Place of Origin":"Guangdong, China"}}
{"title":"Silicone Encapsulant HN-8820 | 2.0 W\/m\u00b7K | For Electronics & Automotive Modules","imgUrl":"https:\/\/img.chinax.com\/nimg\/46\/56\/9eb64c0f7a4485034aecefca7afb-200x200-1\/silicone_encapsulant_hn_8820_7c_2_0_w_2fm_c2_b7k_7c_for_electronics_26_automotive_modules.jpg","attrs":{"Mix Ratio":"5000\u20138000 cP","Pot Life (25\u00b0C)":"40-60 minutes","Cure Time (25\u00b0C)":"4-6 hours (tack-free), 24 hours (full cure)","Hardness":"45\u201350 Shore A"}}
Thermal Conductive Potting Compound 2.0W/m·K UL94 V-0 Two Component Silicone for New Energy Module Heat Dissipation
Thermally Conductive Potting Compound HN-8820
HN-8820 is a two-component addition-cure silicone potting compound engineered for high-performance thermal management in new energy applications. Delivering an exceptional thermal conductivity of 2.0 W/m·K and UL94 V-0 flame retardancy, it provides reliable encapsulation and heat dissipation for power electronics operating under demanding conditions. The convenient 1:1 mix ratio ensures simple processing in both manual and automated production lines.
Broad Temperature Range: Stable performance from -40°C to 150°C for harsh environments
1:1 Mix Ratio: Simple processing with standard metering equipment; no complex ratio control required
Waterproof & Moisture-Resistant: Provides long-term protection against humidity and environmental stress
Anti-Aging Performance: Resistant to yellowing and thermal degradation over extended service life
Low Viscosity (5000-8000 cP): Ensures complete filling of complex geometries and deep sections
Applications
New Energy Power Modules: Ideal for encapsulating IGBT modules, MOSFET arrays, and power converters in EV and BESS systems where efficient heat dissipation is critical.
Automotive Electronics: Protects ECUs, onboard chargers (OBC), DC-DC converters, and battery management systems (BMS) from thermal stress and vibration.
Solar Inverters: Provides reliable thermal potting for photovoltaic inverter components exposed to outdoor temperature fluctuations and moisture.
Network Transformers: Suitable for potting high-frequency transformers and inductors requiring combined thermal management and electrical insulation.
LED Drivers: Extends service life of LED power supplies by efficiently dissipating heat and preventing moisture ingress.
Sensor Modules: Encapsulates sensitive sensor electronics in industrial automation and IoT applications requiring environmental protection.
Technical Parameters
Property
Value
Mix Ratio (A:B)
1:1
Viscosity
5000-8000 cP
Thermal Conductivity
2.0±0.1 W/m·K
Hardness
45-55 Shore A
Volume Resistivity
>5.0*10¹⁴ Ω·cm
Flame Retardant
UL94 V-0
Operating Time (25°C)
1-2 Hours
Curing Time (25°C)
2-4 Hours
Temperature Range
-40°C ~ 150°C
Shelf Life
6 Months
Packaging & Supply
Standard Package: 50KG/Set (Part A: 25KG + Part B: 25KG). Custom packaging available upon request.
MOQ: 50 Kilograms.
Supply Capacity: 100 Tons per month with consistent batch-to-batch quality.
Delivery: 5-7 days for standard orders.
Certifications: ROHS, SGS, UL94 V-0 compliant. Full MSDS and TDS documentation provided with every shipment.