Shenzhen Hanast New Material co.,LTD
| Cure Time | 4-6 h |
| Hardness | 45-50 Shore A |
| Heat Cure | 10-20 min at 80C |
| Viscosity | 5000-8000 cPs |
| Supply Ability | 500KG per Month |
| Pot Life | 6-12Month |
| color | Black,grey，white |
| Thermal Conductivity | 2.0 W/mK |
| Flame Retardant Rating | UL 94 V-0 |
| Delivery Time | 3-5 working days for samples, 7-15 days for bulk orders |
| Packaging Details | 50 kg/set (A: 25 kg + B: 25 kg drums), export-grade industrial packaging |
| Mix Ratio | 1:1 (A:B) |
| Payment Terms | T/T,L/C,PayPal,WU |
| Solvent Content | Solvent Free |
| Brand Name | Hanast |
| Model Number | HN-8820 |
| Certification | UL 94 V-0, RoHS, REACH, ISO 9001 |
| Place of Origin | Shenzhen, Guangdong, China |
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Product Specification
| Cure Time | 4-6 h | Hardness | 45-50 Shore A |
| Heat Cure | 10-20 min at 80C | Viscosity | 5000-8000 cPs |
| Supply Ability | 500KG per Month | Pot Life | 6-12Month |
| color | Black,grey，white | Thermal Conductivity | 2.0 W/mK |
| Flame Retardant Rating | UL 94 V-0 | Delivery Time | 3-5 working days for samples, 7-15 days for bulk orders |
| Packaging Details | 50 kg/set (A: 25 kg + B: 25 kg drums), export-grade industrial packaging | Mix Ratio | 1:1 (A:B) |
| Payment Terms | T/T,L/C,PayPal,WU | Solvent Content | Solvent Free |
| Brand Name | Hanast | Model Number | HN-8820 |
| Certification | UL 94 V-0, RoHS, REACH, ISO 9001 | Place of Origin | Shenzhen, Guangdong, China |
| High Light | Solvent Free Flexible Thermal Encapsulant ，Motor Drive RF Module Potting Gel ，Automotive Electronics Adhesion Protection | ||
HN-8820 is a solvent-free two-part addition-cure silicone encapsulant manufactured by Shenzhen Hanast New Material Co., Ltd. Engineered for automotive electronics encapsulation, motor drive controller potting, RF communication module protection, and consumer electronics, this flexible thermal potting gel delivers 2.0W/mK thermal conductivity with excellent substrate adhesion and thermal cycling resistance. UL 94 V-0 certified with simple 1:1 processing and optional 80°C heat cure acceleration.
| Application | Protection Benefit |
|---|---|
| Automotive ECU Modules | Engine bay thermal cycling and vibration resistant encapsulation |
| Motor Drive Controllers | IGBT/MOSFET thermal management and electrical insulation for VFD and servo drives |
| Battery Management Systems | BMS circuit board moisture-proof and overheating protection |
| RF Communication Modules | Low-loss dielectric encapsulation for 5G and telecom RF power amplifiers |
| Consumer Electronics | Power adapter, charger, and smart home device potting with safety compliance |
| Automotive Sensors | Under-hood sensor module environmental sealing and heat dissipation |
| Industrial Automation | PLC, HMI, and factory control electronics long-term protection |
| Solution | Thermal Conductivity | Electrical Insulation | Environmental Seal | Reworkable |
|---|---|---|---|---|
| HN-8820 Silicone Encapsulant | 2.0 W/mK | Excellent | Complete | Yes |
| Thermal Gap Filler Pad | 1.0-5.0 W/mK | Limited | None | Yes |
| Thermal Grease/Paste | 1.0-8.0 W/mK | None | None | Yes |
| Epoxy Encapsulant | 0.5-1.5 W/mK | Good | Complete | No |
As a direct silicone encapsulant manufacturer in Shenzhen, Guangdong, we provide:
| Parameter | Specification |
|---|---|
| Mix Ratio | 1:1 (A:B) by weight |
| Viscosity (Mixed) |
5000-8000 cPs |
| Pot Life (25°C) | 6-12Month |
| Cure Time (25°C) | 4-6 hours |
| Heat Cure (80°C) | 10-20 minutes |
| Hardness | 45-50 Shore A |
| Thermal Conductivity | 2.0 W/mK |
| Flame Retardant Rating | UL 94 V-0 (self-extinguishing) |
| Solvent Content | 0% (solvent-free formulation) |
Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
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