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Hangzhou Windmill Photonics Technologies Development Co., Ltd.
Hangzhou Windmill Photonics Technology Development Co., Ltd. is a high-tech enterprise specializing in semiconductor laser chips and related laser devices as its core products. We focus on the development of optical chips for applications such as modern communications, Internet of Things sensing, Gas sensing, advanced autonomous driving, low-altitude aircraft, and medical aesthetics. The core products include 1310/1550/1625/1630 nm single-mode FP chips, 1550 nm multi-mode FP chips, 1310/1550 nm narrow-linewidth high-power DFB chips, 1653/1676nm DFB chips, 1310/1550 nm high-polarization SLD chips, various packaged devices, laser driver boards, and more. The company is committed to addressing customer needs with reliable products and aims to be a provider of high-power semiconductor laser solutions with a competitive cost-performance advantage in the industry.
Basic Information
Company Name:
Hangzhou Windmill Photonics Technologies Development Co., Ltd.
Business Type:
Distributor/Wholesaler,Trading Company,Seller
Brands:
Windmill
Year Established:
2021
Company Location:
Room 402, Building 7, Zhongke Intelligent Manufacturing Industrial Park, No.1 Zhenning Road, Xiaoshan District, Hangzhou
Factory Location:
Room 402, Building 7, Zhongke Intelligent Manufacturing Industrial Park, No.1 Zhenning Road, Xiaoshan District, Hangzhou
Trade & Market
Service:
We specialize in the development and manufacturing of high-performance semiconductor chips and integrated photonic solutions. Our core product portfolio includes:
High-Performance Semiconductor Chips
* **FP Laser Chips:** High-power Single-Mode FP chips (1310nm, 1550nm, 1625nm) and Multi-Mode FP chips (1550nm). * **DFB Laser Chips:** High-power, narrow-linewidth DFB chips (1310nm, 1550nm), as well as specialized 1653nm and 1676nm DFB chips. * **SLD Series:** High-polarization Superluminescent Diodes (SLD) available in 1310nm and 1550nm.
Advanced Packaging Solutions
To meet diverse customer requirements, we offer flexible packaging options for all chip types, including: * **Chip on Submount (COS)** * **TO-Can Packaging:** TO56, TO60, and Pigtail TO-Can configurations. * **Butterfly Modules:** High-reliability butterfly packages for demanding environments.
Integrated Modules & Customization
Beyond components, we provide full-stack integration services tailored to specific application scenarios: * **Custom Module Development:** Design and fabrication of various optical modules integrated with precision drivers and PCBs. * **Passive Integration:** Advanced optical engine solutions such as **16×16** and **32×32 AWGR** (Arrayed Waveguide Grating Routers).
