Product Specification

High Speed Full Automatic Smt Line For Electronics Production Machinery SAMSUNG SM481 Pick And Place Machine SMT Machine Solution PCB Smt Assembly Line

Description

Full Automatic SMT Assembly Line Overview

This integrated production line is designed for high-precision manufacturing of PCB assemblies, supporting components as small as 0402 (0.4mm x 0.2mm). It is optimized for applications in LED lighting systems, home appliance control boards, and LED driver modules, ensuring efficiency, accuracy, and scalability. The line includes four core machines: GKG GSE solder paste printer, Samsung pick-and-place machine, HXT 8-zone reflow oven, and HXT 2D offline AOI machine.

GKG GSE Solder Paste Printer  

Vision Alignment System: Dual CCD cameras capable of recognizing Fiducial marks on high-reflectivity aluminum substrates (common in LED lighting boards).  

Printing Control: Servo-driven squeegee with adaptive pressure adjustment. 

Stencil Compatibility: Supports Automatic stencil cleaning cycles reduce downtime.  

Industry-Specific Adaptations:  

LED Lighting: Handles large aluminum substrates (up to 737mm x 737mm) with anti-glare coating to prevent misalignment.  

Home Appliances: Quick-change stencil clamps enable fast transitions between FR4 PCBs (for control boards) and flexible substrates (for sensor modules).

Samsung SM481 Plus Pick-and-Place Machine

High-speed component placement with micron-level precision.  

Speed & Accuracy: Achieves 40,000 components per hour (CPH) in chip-shooter mode. Placement accuracy of ±40μm (3σ) for 0402 components.  

Feeder System: 120 feeder slots (8mm/12mm/16mm tape), with optional tray units for large components like LED drivers or relays.  

Nozzle Configuration: 10-head rotary turret with specialized nozzles: - 0402 components: 0.3mm vacuum nozzles.  

LEDs and ICs: 1.0mm gripper nozzles for QFN-0.4mm pitch and 2835/5050 LED packages.  

Industry-Specific Adaptations:  

LED Drivers: Handles tall components (up to 12mm height) such as electrolytic capacitors and transformers.  

Smart Home Devices: Precision placement of 0402 thermistors and 6-pin WiFi modules for IoT-enabled appliances.  

HXT-8-Zone Reflow Oven  

Solder joint formation with controlled thermal profiles.  

Temperature Zones: 8 independently controlled zones (3 preheat, 2 soak, 2 reflow, 1 cooling). Max temperature 350°C, suitable for lead-free (SAC305) and low-temperature (SnBiAg) solders.  

Conveyor System: Dual-lane transport with adjustable speed (0-2000mm/min), supporting PCB width sizes up to 450mm.  

Industry-Specific Adaptations: LED Modules: Optimized cooling prevents thermal stress on ceramic-based LED substrates.

High-Power Drivers: Custom profiles for thick-copper PCBs (2oz), ensuring complete solder melting without warping.  

HXT 2D Offline AOI Machine  

Post-reflow quality inspection and defect detection.  

Optical System: 5MP high-resolution cameras with coaxial lighting, detecting 0201 component misalignment (≥15μm offset) and solder bridging (≥20μm).  

Inspection Algorithms: Pre-programmed templates for common defects:  

  - Missing components.  

  - Testing element 0201 components, 0.3 mm pitch and above IC (optional can reach 01005 components).

  - Insufficient solder on LED pads.  

Data Integration: Ethernet connectivity for real-time defect mapping and integration with MES systems.  

Industry-Specific Adaptations:  

LED Lighting: Additional color analysis to identify incorrect LED binning (CCT deviations).  

Appliance Safety: Polarity checks for capacitors and diodes to prevent reverse mounting in control boards.

Applications:

This line offers a 20-30% cost reduction versus manual assembly for high-mix production, making it ideal for manufacturers targeting lighting, smart home, and power electronics markets.