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Hing Technology Co. Ltd

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China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers

  1. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
  2. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
  3. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
  4. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
  5. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers
  6. China Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers

Minimum Trace Spacing 3 Mil Semiconductor Package Substrate Utilizing FR4 Rogers

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Minimum Trace Spacing 3 Mil (0.075mm)
Place Of Origin China
Dielectric Constant 3.5 - 10 (depending On Substrate)
Working Temp -40~+85
Surface Finish HASL / ENIG / OSP / Immersion Silver / Immersion Tin
Operating Temperature -40°C To 130°C
Copper Thickness 0.5oz - 3oz
Thickness 0.1mm - 3.0mm
Application High Frequency Circuits, RF Modules, LED Lighting, Automotive Electronics
Model Number H-STP
Brand Name Hing

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  1. Product Details
  2. Company Details

Product Specification

Minimum Trace Spacing 3 Mil (0.075mm) Place Of Origin China
Dielectric Constant 3.5 - 10 (depending On Substrate) Working Temp -40~+85
Surface Finish HASL / ENIG / OSP / Immersion Silver / Immersion Tin Operating Temperature -40°C To 130°C
Copper Thickness 0.5oz - 3oz Thickness 0.1mm - 3.0mm
Application High Frequency Circuits, RF Modules, LED Lighting, Automotive Electronics Model Number H-STP
Brand Name Hing

Product Description:

The Substrate PCB is a highly versatile and advanced printed circuit board designed to meet the rigorous demands of modern electronic applications. With thickness options ranging from 0.1mm to 3.0mm, this product provides exceptional flexibility in design, enabling engineers to create compact and efficient electronic devices. Whether you are working on high-frequency circuits or complex multi-layer assemblies, the Substrate PCB offers the reliability and performance needed to excel in today's competitive market.

One of the key features of this Substrate PCB is its compatibility with a wide range of materials, including FR4, Rogers, Polyimide, and Ceramic. Each material brings unique advantages to the table, making this product suitable for a variety of applications. FR4 is well-known for its affordability and general-purpose use, while Rogers material stands out for its superior high-frequency performance, ideal for RF modules and communication devices. Polyimide substrates offer excellent thermal stability and flexibility, making them suitable for applications that require durability under mechanical stress. Ceramic substrates, on the other hand, provide outstanding thermal conductivity and electrical insulation, which are crucial for high-performance semiconductor package substrates and IC substrate manufacturer requirements.

The Substrate PCB supports a layer count ranging from 1 to 32 layers, accommodating simple single-layer circuits as well as complex multi-layer designs. This scalability makes it an excellent choice for a broad spectrum of electronic products, from basic LED lighting systems to sophisticated automotive electronics that require robust and reliable circuitry. The ability to customize the number of layers ensures that designers can optimize the electrical performance and mechanical strength of their PCBs according to the specific needs of their projects.

In terms of environmental resilience, the Substrate PCB is engineered to operate efficiently within a wide temperature range of -40°C to +85°C. This broad working temperature range makes it ideal for use in harsh environments, such as automotive electronics where temperature fluctuations are common, or in outdoor LED lighting applications that must withstand varying weather conditions. The reliable thermal performance ensures that the PCB maintains its integrity and functionality even under extreme conditions, reducing the risk of failure and extending the lifespan of the end products.

Applications of the Substrate PCB are diverse and impactful across several high-tech industries. It is extensively used in high-frequency circuits, where signal integrity and low loss are critical for optimal performance. RF modules benefit from the excellent dielectric properties of materials like Rogers and ceramic, enabling high-speed data transmission and reduced signal interference. The product is also widely employed in LED lighting, providing a stable and efficient platform that supports improved heat dissipation and energy efficiency. Furthermore, the automotive electronics sector relies heavily on this substrate for its durability and capacity to perform reliably under stringent conditions, making it a trusted choice for manufacturers aiming to deliver safe and high-quality automotive components.

As a leading IC substrate manufacturer, we ensure that each Substrate PCB meets the highest industry standards for quality and performance. Our expertise in producing semiconductor package substrates guarantees that our products support the latest advancements in semiconductor technology, contributing to the development of cutting-edge electronic devices. With a focus on innovation, precision, and customer satisfaction, our Substrate PCB stands out as a critical component for engineers and designers seeking superior electronic substrates.

In summary, the Substrate PCB combines a wide range of thickness options, multiple material choices, extensive layer configurations, and robust thermal capabilities to deliver a product that excels across various demanding applications. Whether you require a ceramic substrate for high-power electronics or a flexible polyimide base for dynamic environments, this product offers the performance and reliability essential for success in the fields of semiconductor packaging, high-frequency communication, LED lighting, and automotive electronics. Choosing this Substrate PCB ensures that your electronic designs are supported by a reliable foundation engineered for excellence.


Applications:

The Hing H-STP Substrate PCB, originating from China, is a versatile and high-performance solution designed to meet the diverse needs of modern electronics manufacturing. With a material selection that includes FR4, Rogers, Polyimide, and Ceramic, this product offers exceptional reliability and durability across various application environments. Its operating temperature range from -40°C to 130°C ensures stable performance even under extreme conditions, making it ideal for both industrial and consumer electronics.

One of the primary application occasions for the Hing H-STP substrate PCB is in the development of IC substrate prototypes. Engineers and designers rely on this product to create accurate and reliable prototypes that simulate the performance of final integrated circuit packages. The ability to support a minimum trace width of just 3 mil (0.075mm) allows for high-density interconnections, which are crucial when developing cutting-edge IC substrate prototypes that demand precision and miniaturization.

In addition to prototyping, the Hing H-STP substrate PCB is widely used in the fabrication of ABF substrates. These substrates are essential components in advanced semiconductor packaging, providing the necessary electrical and thermal management properties to support high-performance processors and memory devices. The availability of 1 to 32 layers in this product line offers the flexibility needed to meet the complex routing and signal integrity requirements of ABF substrates.

Package substrate manufacturing is another critical scenario where the Hing H-STP substrate PCB excels. It serves as the foundation for many package substrates that house semiconductor chips, enabling efficient electrical connections and protecting sensitive components. The variety of surface finishes available, including HASL, ENIG, OSP, Immersion Silver, and Immersion Tin, allows manufacturers to select the optimal finish for solderability and corrosion resistance based on their specific package substrate needs.

Overall, the Hing H-STP Substrate PCB is well-suited for applications ranging from prototype development to mass production in sectors such as telecommunications, automotive electronics, medical devices, and consumer gadgets. Its combination of advanced materials, broad layer options, fine trace capabilities, and robust surface finishes make it an indispensable tool for engineers and manufacturers aiming to produce high-quality IC substrates, ABF substrates, and package substrates.


Customization:

Hing is a leading ceramic PCB manufacturer specializing in high-quality substrate PCB products. Our model H-STP, made in China, is designed to meet the demanding requirements of high frequency circuits, RF modules, LED lighting, and automotive electronics. With an operating temperature range from -40°C to 130°C and a working temperature of -40~+85°C, the H-STP substrate PCB ensures reliable performance under extreme conditions.

As a trusted ceramic PCB supplier, Hing offers customization services that include a minimum trace spacing of 3 Mil (0.075mm) and copper thickness options ranging from 0.5oz to 3oz. Our HDI substrate technology provides enhanced circuit density and precision, making it an ideal choice for advanced electronic applications.

Choose Hing for your substrate PCB needs and benefit from our expertise as a ceramic PCB manufacturer delivering superior quality, durability, and performance tailored to your specific requirements.


Support and Services:

Our Substrate PCB products are designed to meet the highest standards of quality and reliability for a wide range of applications. To ensure optimal performance and longevity of your substrates, we offer comprehensive technical support and services tailored to your specific needs.

Our technical support team is available to assist you with product selection, design recommendations, and troubleshooting. We provide detailed documentation including datasheets, application notes, and design guidelines to help you integrate our Substrate PCBs seamlessly into your projects.

In addition to technical assistance, we offer custom fabrication services to accommodate unique specifications and complex designs. Our quality control processes ensure that every substrate meets stringent industry standards and customer requirements.

We also provide training and workshops to keep your engineering team updated on the latest substrate technologies and best practices. Our goal is to support you throughout the entire product lifecycle, from initial design to final production.

For ongoing maintenance and upgrades, we offer repair services and replacement parts to minimize downtime and maintain system integrity. Partner with us to leverage our expertise and ensure the success of your substrate PCB applications.


FAQ:

Q1: What is the brand and model number of this Substrate PCB?

A1: The Substrate PCB is from the brand Hing, and the model number is H-STP.

Q2: Where is the Hing H-STP Substrate PCB manufactured?

A2: The Hing H-STP Substrate PCB is manufactured in China.

Q3: What materials are used in the Hing H-STP Substrate PCB?

A3: The Hing H-STP Substrate PCB is made from high-quality substrate materials designed to ensure excellent electrical performance and durability.

Q4: What applications are suitable for the Hing H-STP Substrate PCB?

A4: The Hing H-STP Substrate PCB is ideal for use in various electronic devices, including consumer electronics, telecommunications, and automotive electronics.

Q5: Can the Hing H-STP Substrate PCB be customized?

A5: Yes, customization options for the Hing H-STP Substrate PCB are available to meet specific design and size requirements.


Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller,Exporter

  • Year Established:

    2016

  • Total Annual:

    4000000-5000000

  • Employee Number:

    200~300

  • Ecer Certification:

    Verified Supplier

Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,... Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first,...

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  • Hing Technology Co. Ltd
  • Building No1 Niumendi Industrial Park Number 171 Longwei Road, Longwei Community Meilin Street,Futian district Shenzhen
  • https://www.szhingtech.com/

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