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Tailored for high-precision semiconductor manufacturing, this integrated cleaning system combines multi-stage ultrasonic processes to deliver sub-ppb level surface purity, a critical prerequisite for silicon wafer fabrication in advanced node (≤7nm) microelectronics production.
Stage-by-Stage Cleaning Mechanism:
Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.
Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).
Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.
Technical Specifications:
Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)
Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress
Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding
Core Performance Metrics:
Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants
Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)
Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration
Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.
This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
4,397,596.73-6,397,596.73
Employee Number:
460~500
Ecer Certification：
Verified Supplier
Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t... Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t...
