guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
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China,Dongguan ,Guangdong
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Verified Supplier
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- Semiconductor Silicon Wafer Cleaner - Ultrasonic Alkaline/Acid Cleaning + DI
- Product Details
- Company Details
Product Specification
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| Payment Terms |
T/T |
Supply Ability |
One unit. It will take 30 to 60 days. |
| Delivery Time |
30-60work days |
Packaging Details |
Packaging: Wooden case, wooden frame, stretch film. Dimensions: 12M*2M*2.8M |
| Model |
JTM-100504AD |
Power |
120KW |
| Type |
Ultrasonic alkaline washing+Ultrasonic acid washing+Pure water rinsing |
Cleaning Frequency |
40KHZ/80KHZ |
| Number of Tanks |
10 |
Cleaning temperature |
60℃ |
| Overall Dimensions |
12M*2M*2.8M |
Name |
Semiconductor Cleaning Machine |
| Brand Name |
Jietai |
Model Number |
JTM-100504AD |
| Certification |
CE, FCC, ROHS, etc. |
Place of Origin |
Dongguan, Guangdong |
Product Introduction: Semiconductor Silicon Wafer Cleaner
Engineered specifically for semiconductor manufacturing, this precision cleaning system integrates multi-stage ultrasonic processes to meet the stringent surface purity requirements of silicon wafers, ensuring minimal particle contamination and residual removal critical for wafer fabrication.
Core Cleaning Processes:
- Ultrasonic Alkaline Cleaning: Utilizes alkaline chemistry combined with ultrasonic energy to effectively remove organic contaminants, photoresist residues, and large particulate matter from wafer surfaces, preparing substrates for subsequent processing.
- Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxides) through acid-based ultrasonic treatment, leveraging cavitation effects to dislodge submicron contaminants embedded in wafer textures or patterned structures.
- DI Water Rinsing: Final stage employs high-purity deionized water for thorough rinsing, eliminating residual cleaning agents and ensuring surface neutrality, a prerequisite for post-cleaning wafer handling and processing.
Technical Specifications:
- Ultrasonic Frequency: 40KHz-80KHz (multi-frequency adjustable, optimizing cavitation intensity for different contamination types)
- Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity and cleaning efficiency)
- Material Compatibility: Constructed with PVDF, quartz, and 316L stainless steel components to resist corrosive chemistries and prevent secondary contamination.
Key Advantages:
- Achieves sub-10nm particle removal efficiency, compliant with SEMI standards for advanced wafer processing
- Multi-frequency ultrasonic configuration adapts to diverse cleaning requirements (from bare wafer to patterned wafer stages)
- Closed-loop temperature control ensures process repeatability, critical for batch-to-batch consistency
- Integrates seamlessly into semiconductor front-end and back-end manufacturing lines
Application: Ideal for cleaning silicon wafers in IC manufacturing, MEMS fabrication, and semiconductor packaging processes, where surface integrity directly impacts device performance and yield.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ temperature control, silicon wafer processing
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
-
Business Type:
Manufacturer
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Total Annual:
4,397,596.73-6,397,596.73
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Employee Number:
460~500
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Ecer Certification：
Verified Supplier
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