Unicomp Technology
| Delivery Time | 15 work days |
| Payment Terms | L/C,T/T |
| Supply Ability | 30 sets per month |
| Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Warranty | 1 year |
| Pixel Matrix | 1536*1536[pixel] |
| Frame Rates | Max30fps |
| RAM | 16G |
| Hard Disk | 1TB HDD |
| Type | Electronic semiconductor detection equipment |
| Brand Name | UNICOMP |
| Model Number | AX8300 |
| Certification | CE, FDA |
| Place of Origin | China |
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Product Specification
| Delivery Time | 15 work days | Payment Terms | L/C,T/T |
| Supply Ability | 30 sets per month | Packaging Details | Wooden Case, Waterproof, Anti-collision |
| Warranty | 1 year | Pixel Matrix | 1536*1536[pixel] |
| Frame Rates | Max30fps | RAM | 16G |
| Hard Disk | 1TB HDD | Type | Electronic semiconductor detection equipment |
| Brand Name | UNICOMP | Model Number | AX8300 |
| Certification | CE, FDA | Place of Origin | China |
| High Light | 20W Thermal Temperature Detection Portals ，IR Thermal Temperature Detection Portals ，RJ45 Access Control Temperature Sensor | ||
Unicomp X-ray Detector AX8300
The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.
It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.
Featuring a high-end flat-panel detector (FPD), the AX-8300 captures ultra-magnified, high-resolution imaging with finesse equivalent to premium 90kV micro-focus X-ray systems. Moreover, the integrated 360° rotary worktable enables omnidirectional multi-angle scanning, facilitating comprehensive dimensional and defect assessment.
Features:
Application:
1. BGA/CSP/FLIPS CHIP: Bridging ,Voids,Opens,Expcessive/insufficient
2. QFN: Bridging,Voids,Opens,Registration
3. SMT Standard components: QFP,SOT,SOIC,Chips,Connectors,Others
4. Semiconductor: bond wire,die attach VOID ,MOLD,VOID
5. Multi-layer board(MLB): Inner layer registration,PAD stack,blind/buried vias
|
Model |
AX8300 |
|
Max kV/type |
110 kV/Sealed |
|
Power Consumption |
900W |
|
Max.Electron beam power |
25W |
|
Focal spot size |
5μm |
|
Geometric magnification |
49.8X |
|
Imaging system(Option) |
Flat Panel Detector |
|
Monitors |
27" HD 4K display |
|
Product Dimensions |
1200x1285x1700mm |
|
Weight |
1345kg |
|
Radiation safety |
<1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
|
Control |
Keyboard/Mouse/Joystick |
|
Automated inspection |
Standard |
|
Primary applications |
Chip inspection/Electronic components/Auto parts.etc |
|
1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission. |
|
Inspection Images:
Company Details
Business Type:
Manufacturer,Exporter,Seller
Year Established:
2002
Total Annual:
60 Million-100 Million
Employee Number:
1000~1500
Ecer Certification：
Verified Supplier
X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip... X-ray Intelligent Detection System Integrator (Testing Equipment + Industrial Cloud Tracking System) Shenzhen Unicomp Technology was incorporated in 2002. It is a national-level high-tech enterprise which involved in the R&D and manufacturing of X-ray technology and intelligent detection equip...
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