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Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China 4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG
China 4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG

  1. China 4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG

4 Layer 1+N+1 HDI Printed Circuit Board Assembly With Laser Microvias ENIG

  1. MOQ: 1
  2. Price: Negotiable
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Material FR-4 TG150
Delivery Time 8-15DAYS
Payment Terms Western Union
Supply Ability 1 Million Square feet/per month
Board Thickness 0.33mm (Customizable)
Copper Thickness 1/0.5/0.5/1 oz
Layer Count 4-Layer
Model Number XSWPCB
Certification UL ,IOS9000
Place of Origin China
Brand Name XSW PCB

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  1. Product Details
  2. Company Details

Product Specification

Material FR-4 TG150 Delivery Time 8-15DAYS
Payment Terms Western Union Supply Ability 1 Million Square feet/per month
Board Thickness 0.33mm (Customizable) Copper Thickness 1/0.5/0.5/1 oz
Layer Count 4-Layer Model Number XSWPCB
Certification UL ,IOS9000 Place of Origin China
Brand Name XSW PCB
High Light 4 Layer HDI Printed Circuit BoardCustom HDI Printed Circuit BoardHDI PCB ENIG Finish
Custom 4 Layer 1+N+1 HDI PCB Board Assembly with Laser Microvias and ENIG Finish

Custom 4 Layer 1+N+1 HDI PCB Board Assembly with Laser Microvias and ENIG Finish is designed for high-density electronic applications that require enhanced signal integrity, compact layouts, and reliable performance. Utilizing advanced laser-drilled microvia technology, this HDI PCB enables higher routing density, reduced signal loss, and improved electrical performance compared to conventional multilayer boards. The 1+N+1 stack-up structure provides an ideal balance between complexity, cost efficiency, and manufacturing reliability.

Key Specifications
Layer Count 4-Layer
Material FR-4 TG150
Board Thickness 0.33mm (Customizable)
Copper Thickness 1/0.5/0.5/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Black
Surface Finish  Immersion Gold (ENIG)

 

Product Description

  • Advanced 1+N+1 HDI Structure
    • Optimized stack-up design with laser-drilled microvias for higher routing density and improved circuit integration.
    • Ideal for compact and high-performance electronic products.
  • Laser Microvia Technology
    • Precision laser-drilled blind vias ensure reliable interconnection between layers.
    • Supports fine-pitch components and complex PCB layouts.
  • High-Density Interconnect Design
    • Enables more components to be placed within limited board space.
    • Reduces PCB size while maintaining excellent electrical performance.
  • Premium ENIG Surface Finish
    • Excellent solderability and flat surface for SMT assembly.
    • Superior oxidation resistance and extended shelf life.
    • Suitable for BGA, QFN, and other fine-pitch packages.
  • Enhanced Signal Integrity
    • Shorter signal paths help minimize signal loss and electromagnetic interference (EMI).
    • Supports high-speed and high-frequency circuit applications.
  • Improved Reliability and Durability
    • Strong interlayer connections provide excellent mechanical and thermal reliability.
    • Designed for long-term operation in demanding environments.
  •  
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

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Get in touch with us

  • Reach Us
  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

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