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Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China 10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision
China 10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision

  1. China 10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision

10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision

  1. MOQ: 1
  2. Price: Negotiable
  3. Get Latest Price
Material FR-4
Delivery Time 8-15DAYS
Surface Finish Immersion Gold (ENIG)
Payment Terms Western Union
Supply Ability 1 Million Square feet/per month
Board Thickness 1.0mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1oz
Layer Count 10-Layer
Model Number XSWPCB
Certification UL ,IOS9000
Place of Origin China
Brand Name XSW PCB

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  1. Product Details
  2. Company Details

Product Specification

Material FR-4 Delivery Time 8-15DAYS
Surface Finish Immersion Gold (ENIG) Payment Terms Western Union
Supply Ability 1 Million Square feet/per month Board Thickness 1.0mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1oz Layer Count 10-Layer
Model Number XSWPCB Certification UL ,IOS9000
Place of Origin China Brand Name XSW PCB
High Light 10 Layer High Density Interconnect PCBElectronics High Density Interconnect PCB
10 Layer High-Density Interconnect PCB with Blue Solder Resist for Precision Electronics

Custom 10 Layer 1+N+1 HDI PCB with Blue Solder Mask and ENIG Finish is engineered for high-density electronic applications requiring reliable blind-via interconnections, excellent solderability, and superior manufacturing consistency. Featuring a 10-layer stack-up combined with first-order HDI technology, the PCB provides enhanced routing capability and optimized signal integrity for advanced electronic devices.

Key Specifications
Layer Count 10-Layer
Material FR-4
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Blue
Surface Finish   Immersion Gold (ENIG)

 

Product Description

10-Layer 1+N+1 HDI Structure

  • Advanced multilayer PCB design with first-order HDI technology.
  • Optimized routing density and signal transmission performance.
  • Suitable for compact, high-performance electronic products.

High Blind-Via Yield Control

  • Laser-drilled blind vias with strict process management.
  • No stub residue permitted at blind-via bottoms.
  • Ensures stable electrical connectivity and long-term reliability.

Advanced Desmear Process

  • Complete resin removal after laser drilling.
  • Backlight inspection grade ≥ Level 9.
  • Improves metallization quality and via reliability.

Premium Blue Solder Mask Technology

  • Industry-standard blue solder resist with excellent appearance.
  • Optimized for fine-line circuit manufacturing.
  • Provides strong environmental and chemical resistance.

Low-Viscosity Ink Process

  • Special low-viscosity solder mask formulation.
  • Enhanced coating uniformity across high-density structures.
  • Reduces risk of incomplete development.

Precision Screen Printing Control

  • Printing pressure maintained between 4–6 kg/cm².
  • Prevents ink penetration into microvias and drilled holes.
  • Ensures accurate solder mask definition.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

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Get in touch with us

  • Reach Us
  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

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