Shenzhen Xunsiwei Circuit Co., Ltd.
| Material | FR4 |
| Delivery Time | 8-15DAYS |
| Payment Terms | Western Union |
| Board Thickness | 2mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Supply Ability | 1 Million Square feet/per month |
| Layer Count | 10-Layer |
| Model Number | XSWPCB |
| Certification | UL ,IOS9000 |
| Place of Origin | China |
| Brand Name | XSW PCB |
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Product Specification
| Material | FR4 | Delivery Time | 8-15DAYS |
| Payment Terms | Western Union | Board Thickness | 2mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 oz | Supply Ability | 1 Million Square feet/per month |
| Layer Count | 10-Layer | Model Number | XSWPCB |
| Certification | UL ,IOS9000 | Place of Origin | China |
| Brand Name | XSW PCB | ||
| High Light | Multilayer HDI PCB Board ，2.0mm HDI PCB Board ，Multilayer PCB Board Assembly | ||
10-layer, three-stage OSP (Optical Sealant Propagation) green solder mask board, featuring a combination of laser-drilled vias and mechanically drilled through-holes, with strict control over drill residue removal and OSP uniformity. Mechanically drilled through-hole burrs are ≤8μm, and overlapping areas with blind vias undergo two rounds of adhesive removal. UV strengthening is applied after green solder mask development to enhance surface hardness. Micro-etching of the copper surface before OSP film application achieves a uniform pink appearance, with a film thickness of 0.25-0.4μm. Four simulated reflow soldering cycles are performed, with a wetting angle ≤25° and no film cracking. Ion contamination testing is conducted on each batch.
| Layer Count | 10-Layer |
| Material | FR4 |
| Board Thickness | 2mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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