| Material | FR4 |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Spacing | 0.075 mm |
| Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Line Width | 0.05 mm |
| Payment Terms | Western Union |
| Delivery Time | 8-15DAYS |
| Layer Count | 8-Layer |
| Model Number | XSWPCB |
| Certification | UL ,IOS9000 |
| Brand Name | XSW PCB |
| Place of Origin | China |
View Detail Information
Explore similar products
10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision
6 Layer HDI Printed Circuit Board Multilayer Control PCB Board Customized
8 Layer 2nd Order HDI OSP Black Solder Mask PCB Via ≤25μM Registration Control
8 Layer Multilayer HDI PCB Manufacturing Service For Industrial Consumer
Product Specification
| Material | FR4 | Minimum Hole Size | 0.1 mm |
| Minimum Line Spacing | 0.075 mm | Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.2mm | Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Line Width | 0.05 mm | Payment Terms | Western Union |
| Delivery Time | 8-15DAYS | Layer Count | 8-Layer |
| Model Number | XSWPCB | Certification | UL ,IOS9000 |
| Brand Name | XSW PCB | Place of Origin | China |
| High Light | 8 Layer High Density Interconnect HDI PCB ,High Density Interconnect HDI PCB Board ,HDI Multilayer PCB FR4 | ||
This product is tailor-made for industrial PLC automation control systems, delivering a reliable and smooth human-machine interaction (HMI) operating experience while providing a comprehensive application solution.
| Layer Count | 8-Layer |
| Material | FR4 |
| Board Thickness | 1.2mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.05 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | OSP |
| Application Field | High-Density Interconnect |
Product Description
High-Density Interconnect (HDI) Technology
High-Density Interconnect (HDI) utilizes microvias with a diameter of ≤0.15 mm, employing advanced fine-line patterning and microvia formation techniques to achieve interconnection of components within an ultra-compact form factor. Its architectural design — characterized by minimized conductor geometries and optimized layer stacking — enables a wiring density that is an order of magnitude higher than that of conventional printed circuit boards (PCBs), making it essential for high-performance miniaturized systems.
Electrical performance is significantly enhanced through precise control of parasitic effects: residual stub inductance is reduced, discrete decoupling capacitors are eliminated via integrated power/ground planes, and crosstalk is minimized through controlled impedance routing. Furthermore, through the strategic placement of thin HDI dielectric layers, radiated electromagnetic interference (RFI/EMI) is lowered by minimizing loop inductance and uniformly distributing capacitance, thereby optimizing signal integrity along high-frequency transmission paths.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
Get in touch with us
Leave a Message, we will call you back quickly!