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Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China 8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness
China 8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

  1. China 8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

8 Layer Multilayer High Density Interconnect HDI PCB Board FR4 1.2mm Thickness

  1. MOQ: 1
  2. Price: Negotiable
  3. Get Latest Price
Material FR4
Minimum Hole Size 0.1 mm
Minimum Line Spacing 0.075 mm
Supply Ability 1 Million Square feet/per month
Board Thickness 1.2mm
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Line Width 0.05 mm
Payment Terms Western Union
Delivery Time 8-15DAYS
Layer Count 8-Layer
Model Number XSWPCB
Certification UL ,IOS9000
Brand Name XSW PCB
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Material FR4 Minimum Hole Size 0.1 mm
Minimum Line Spacing 0.075 mm Supply Ability 1 Million Square feet/per month
Board Thickness 1.2mm Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Line Width 0.05 mm Payment Terms Western Union
Delivery Time 8-15DAYS Layer Count 8-Layer
Model Number XSWPCB Certification UL ,IOS9000
Brand Name XSW PCB Place of Origin China
High Light 8 Layer High Density Interconnect HDI PCBHigh Density Interconnect HDI PCB BoardHDI Multilayer PCB FR4
Customizable High-Density Interconnect (HDI) PCB Boards

This product is tailor-made for industrial PLC automation control systems, delivering a reliable and smooth human-machine interaction (HMI) operating experience while providing a comprehensive application solution.

Key Specifications
Layer Count 8-Layer
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.05 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish  OSP
Application Field High-Density Interconnect

Product Description
High-Density Interconnect (HDI) Technology

High-Density Interconnect (HDI) utilizes microvias with a diameter of ≤0.15 mm, employing advanced fine-line patterning and microvia formation techniques to achieve interconnection of components within an ultra-compact form factor. Its architectural design — characterized by minimized conductor geometries and optimized layer stacking — enables a wiring density that is an order of magnitude higher than that of conventional printed circuit boards (PCBs), making it essential for high-performance miniaturized systems.

Electrical performance is significantly enhanced through precise control of parasitic effects: residual stub inductance is reduced, discrete decoupling capacitors are eliminated via integrated power/ground planes, and crosstalk is minimized through controlled impedance routing. Furthermore, through the strategic placement of thin HDI dielectric layers, radiated electromagnetic interference (RFI/EMI) is lowered by minimizing loop inductance and uniformly distributing capacitance, thereby optimizing signal integrity along high-frequency transmission paths.

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

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 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

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Get in touch with us

  • Reach Us
  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

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