Shenzhen Xunsiwei Circuit Co., Ltd.
| Material | FR-4 |
| Delivery Time | 8-15DAYS |
| Surface Finish | OSP |
| Payment Terms | Western Union |
| Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.0mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1oz |
| Layer Count | 12-Layer |
| Model Number | XSWPCB |
| Certification | UL ,IOS9000 |
| Place of Origin | China |
| Brand Name | XSW PCB |
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Product Specification
| Material | FR-4 | Delivery Time | 8-15DAYS |
| Surface Finish | OSP | Payment Terms | Western Union |
| Supply Ability | 1 Million Square feet/per month | Board Thickness | 1.0mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1/1/1oz | Layer Count | 12-Layer |
| Model Number | XSWPCB | Certification | UL ,IOS9000 |
| Place of Origin | China | Brand Name | XSW PCB |
| High Light | Multilayer HDI Printed Circuit Board ，12 Layer HDI Printed Circuit Board ，High Density Electronics PCB Manufacturing | ||
The manufacturing process focuses on precise dual-laser alignment control. First- and second-stage blind vias are formed through sequential laser drilling, with cumulative microvia offset maintained within ≤25μm. Each laser drilling system is monitored through Statistical Process Control, maintaining a process capability index (CPK) of ≥1.33 to ensure consistent production quality.
To optimize black solder mask performance, exposure energy grid testing is conducted before production. The process ensures complete development and eliminates residue inside blind vias, preventing reliability issues during assembly.
| Layer Count | 12-Layer |
| Material | FR-4 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Black |
| Surface Finish | OSP |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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