Shenzhen Xunsiwei Circuit Co., Ltd.
| Material | FR4 TG170 |
| Delivery Time | 8-15DAYS |
| Surface Finish | ENIG |
| Payment Terms | Western Union |
| Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Layer Count | 6-Layer |
| Model Number | XSWPCB |
| Certification | UL ,IOS9000 |
| Place of Origin | China |
| Brand Name | XSW PCB |
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Product Specification
| Material | FR4 TG170 | Delivery Time | 8-15DAYS |
| Surface Finish | ENIG | Payment Terms | Western Union |
| Supply Ability | 1 Million Square feet/per month | Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz | Layer Count | 6-Layer |
| Model Number | XSWPCB | Certification | UL ,IOS9000 |
| Place of Origin | China | Brand Name | XSW PCB |
| High Light | 6 Layer ENIG PCB ，Custom ENIG PCB | ||
5G optical module 6-layer through-hole immersion gold and green solder mask board, with controlled interlayer misalignment and immersion gold layer stress. Interlayer misalignment ≤50μm, X-ray sampling inspection, warpage ≤0.3%. Drill burrs ≤5μm, hole wall roughness ≤12μm, backlight ≥9 level. Plasma cleaning before immersion gold, gold thickness 0.05-0.10μm, nickel layer phosphorus content 8-11%, internal stress controlled at 80-100MPa. After green solder mask development, side etching ≤4μm, post-curing at 150℃×65min, insulation resistance ≥100MΩ. After thermal stress at 288℃×10s×3 times, through-hole copper elongation ≥12%, green solder mask no bubbling. Ion contamination ≤0.3μg/cm², CAF testing 1000h for each batch. 5G optical module-specific UL code is engraved on the board edge.
| Layer Count | 6-Layer |
| Material | FR-4 TG170 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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