| Material | FR4 TG150 |
| Delivery Time | 8-15DAYS |
| Surface Finish | ENIG |
| Payment Terms | Western Union |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.0 mm (Customizable) |
| Layer Count | 8-Layer |
| Model Number | XSWPCB |
| Place of Origin | China |
| Certification | UL ,IOS9000 |
| Brand Name | XSW PCB |
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Product Specification
| Material | FR4 TG150 | Delivery Time | 8-15DAYS |
| Surface Finish | ENIG | Payment Terms | Western Union |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz | Supply Ability | 1 Million Square feet/per month |
| Board Thickness | 1.0 mm (Customizable) | Layer Count | 8-Layer |
| Model Number | XSWPCB | Place of Origin | China |
| Certification | UL ,IOS9000 | Brand Name | XSW PCB |
| High Light | 8 Layer 5G Optical Module PCB ,8 Layer Optical Transceiver PCB ,5G High Frequency PCB Manufacturer | ||
This 5G optical module features an 8-layer through-hole immersion gold plating with green solder mask, controlling glass cloth protrusion on the hole walls and preventing solder bridges from the green solder mask. Drilling employs a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls, a roughness ≤10μm, and a backlight rating ≥9. The width of the green solder mask is ≥75μm, measured using 3D measurement after development, and then cured at 150℃ for 70min. Plasma cleaning is performed before immersion gold plating, resulting in a gold thickness of 0.05-0.10μm, no black pads in the nickel layer, and a salt spray test duration ≥96h. Ultrasonic scanning after thermal shock shows no delamination, and the copper elongation within the holes is ≥12%. Ion contamination is ≤0.3μg/cm², and each batch undergoes a 1000h CAF test for insulation resistance ≥10^9Ω. A dedicated 5G optical module QR code is laser-engraved on the board surface.
| Layer Count | 8-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 1.0 mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.15 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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