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Shenzhen Xunsiwei Circuit Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China 8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB
China 8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB

  1. China 8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB

8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB

  1. MOQ: 1
  2. Price: Negotiable
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Material FR4 TG150
Delivery Time 8-15DAYS
Surface Finish ENIG
Payment Terms Western Union
Copper Thickness 1/1/1/1/1/1/1/1 oz
Supply Ability 1 Million Square feet/per month
Board Thickness 1.0 mm (Customizable)
Layer Count 8-Layer
Model Number XSWPCB
Place of Origin China
Certification UL ,IOS9000
Brand Name XSW PCB

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  1. Product Details
  2. Company Details

Product Specification

Material FR4 TG150 Delivery Time 8-15DAYS
Surface Finish ENIG Payment Terms Western Union
Copper Thickness 1/1/1/1/1/1/1/1 oz Supply Ability 1 Million Square feet/per month
Board Thickness 1.0 mm (Customizable) Layer Count 8-Layer
Model Number XSWPCB Place of Origin China
Certification UL ,IOS9000 Brand Name XSW PCB
High Light 8 Layer 5G Optical Module PCB8 Layer Optical Transceiver PCB5G High Frequency PCB Manufacturer

5G Optical Module PCB Optical Transceiver PCB High-Frequency PCB Manufacturer

 

This 5G optical module features an 8-layer through-hole immersion gold plating with green solder mask, controlling glass cloth protrusion on the hole walls and preventing solder bridges from the green solder mask. Drilling employs a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls, a roughness ≤10μm, and a backlight rating ≥9. The width of the green solder mask is ≥75μm, measured using 3D measurement after development, and then cured at 150℃ for 70min. Plasma cleaning is performed before immersion gold plating, resulting in a gold thickness of 0.05-0.10μm, no black pads in the nickel layer, and a salt spray test duration ≥96h. Ultrasonic scanning after thermal shock shows no delamination, and the copper elongation within the holes is ≥12%. Ion contamination is ≤0.3μg/cm², and each batch undergoes a 1000h CAF test for insulation resistance ≥10^9Ω. A dedicated 5G optical module QR code is laser-engraved on the board surface.

 

Key Specifications
Layer Count 8-Layer
Material FR-4 TG150
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.15 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

  • High-Reliability 8-Layer PCB Structure
    • Designed for 5G optical communication modules requiring high-speed signal transmission and long-term operational stability.
    • Multilayer stack-up enhances signal integrity and power distribution performance.
  • Advanced Through-Hole Quality Control
    • Double-sided drilling process effectively eliminates glass fiber protrusion on hole walls.
    • Hole wall roughness controlled to ≤10μm, improving plating uniformity and electrical reliability.
    • Backlight inspection rating reaches ≥9, ensuring excellent drilling quality.
  • Optimized Green Solder Mask Process
    • Green solder mask bridge width controlled at ≥75μm through 3D measurement verification after development.
    • Prevents solder bridging and improves assembly yield for fine-pitch components.
    • High-temperature curing at 150℃ for 70 minutes enhances adhesion and chemical resistance.
  • Premium ENIG Surface Finish
    • Plasma cleaning before immersion gold plating improves surface cleanliness and coating adhesion.
    • Gold thickness maintained at 0.05–0.10μm for excellent solderability and contact performance.
    • No black pad defects in the nickel layer, ensuring high reliability for optical module applications.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2009

  • Total Annual:

    600 million-1000 million

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...

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Get in touch with us

  • Reach Us
  • Shenzhen Xunsiwei Circuit Co., Ltd.
  • No. 57, Houting Second Industrial Zone, Shajing Street, Bao'an District, Shenzhen, Guangdong Province, China
  • https://www.xswpcb.com/

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