Shenzhen Xunsiwei Circuit Co., Ltd.
| Delivery Time | 8-15 Days |
| Material | FR-4 High-Tg 170 |
| Min Laser Microvia | 0.1 mm |
| Surface Finish | OSP |
| Payment Terms | T/T, Western Union, PayPal |
| Supply Ability | 1 Million Square Feet per Month |
| Board Thickness | 1.2 mm (Customizable) |
| Layer Registration | 25um |
| Solder Mask Color | Black |
| Min Line Width / Spacing | 0.075 mm / 0.075 mm |
| Packaging Details | Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton |
| Layer Count | 8-Layer 2nd Order HDI |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz |
| LDI Exposure Alignment | +/-5um |
| Model Number | XSW-HDI8 |
| Brand Name | XSW PCB |
| Place of Origin | China |
| Certification | UL, ISO9001 |
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Product Specification
| Delivery Time | 8-15 Days | Material | FR-4 High-Tg 170 |
| Min Laser Microvia | 0.1 mm | Surface Finish | OSP |
| Payment Terms | T/T, Western Union, PayPal | Supply Ability | 1 Million Square Feet per Month |
| Board Thickness | 1.2 mm (Customizable) | Layer Registration | 25um |
| Solder Mask Color | Black | Min Line Width / Spacing | 0.075 mm / 0.075 mm |
| Packaging Details | Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton | Layer Count | 8-Layer 2nd Order HDI |
| Copper Thickness | 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz | LDI Exposure Alignment | +/-5um |
| Model Number | XSW-HDI8 | Brand Name | XSW PCB |
| Place of Origin | China | Certification | UL, ISO9001 |
| High Light | 8 Layer 2nd Order HDI PCB ，25um Registration Control HDI ，OSP Black Solder Mask PCB | ||
This 8-layer 2nd order HDI PCB is built for advanced handheld, medical and communication electronics where 2nd order (stacked) microvias and 25um class layer-to-layer registration are mandatory. Every critical step is driven by high-precision production equipment, so the fine microvia stacks, 0.075mm traces and OSP-protected black solder mask stay perfectly aligned across all eight layers.
LDI replaces film exposure and holds layer image alignment to +/-5um, eliminating film stretch and misregistration on 0.075mm fine lines for consistent fine-line imaging (FLI).
CCD tooling holes are punched to +/-10um and x-ray registration stations verify 8-layer alignment within 25um, giving the stacked microvias a reliable interconnect at every 2nd-order via.
High-resolution AOI inspects 0.075mm traces and 0.1mm microvias, catching opens and shorts that human eyes cannot resolve, with repeatable equipment accuracy.
On-board impedance coupons are measured with calibrated TDR equipment to hold +/-10% impedance, protecting high-speed signal integrity.
| Layer Count | 8-Layer (2nd order HDI stack-up) |
| HDI Type | 2nd order stacked microvia |
| Material | FR-4 High-Tg 170 |
| Board Thickness | 1.2 mm (Customizable 0.8-2.0 mm) |
| Copper Thickness | 1 / 0.5 / 0.5 / 0.5 / 0.5 / 0.5 / 0.5 / 1 oz |
| Min Line Width / Spacing | 0.075 mm / 0.075 mm |
| Min Laser Microvia | 0.1 mm |
| Layer Registration | 25um |
| Solder Mask | Black |
| Surface Finish | OSP |
| Microvia Stacking | Stacked 2nd-order vias demand the tightest registration; 25um alignment keeps every stacked via landed on its pad |
| Fine-Line Yield | LDI +/-5um alignment protects fine traces from opens and shorts at scale |
| OSP Protection | OSP keeps copper pads solderable without a metal finish, ideal for BGA and fine-pitch assembly |
| Testing | Flying probe, impedance coupon, AOI and 100% electrical test |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
600 million-1000 million
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T... Shenzhen Xunsiwei Circuits Co., Ltd. is a professional manufacturer dedicated to the production of high-precision printed circuit boards. Our core product portfolio encompasses single-sided, double-sided, and multilayer PCBs, as well as advanced solutions such as blind/buried via and HDI boards. T...
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