Customized SMT Solder Paste Printing Process For Electronic Components

Product Specification

SMT solder paste printing process , compatible with diversified high-end and low-end production scenarios .

The SMT solder paste printing process mainly relies on high-precision alignment and quantitative deposition. It is compatible with precision electronic components with adjustable and controllable parameters, featuring excellent process stability and full-process quality control, and can adapt to diversified high-end and low-end production scenarios.

I. Technical Features:

- Supported by a high-definition visual alignment system, this process enables micron-level precise alignment between stencil apertures and PCB pads with an alignment accuracy of ±12.5μm. It fully meets the printing requirements of precision components such as 01005 ultra-miniature components, ultra-fine pitch BGAs and QFNs. It effectively avoids common defects including insufficient solder, excessive solder and solder paste offset, ensures consistent solder joint formation, and improves the yield of component mounting and soldering from the source.

- The complete printing process supports refined multi-dimensional parameter adjustment, and core parameters can be dynamically adapted according to product specifications. The squeegee angle is normally maintained at 45°–60°: 60° for conventional surface-mount components, while 45° enhances paste filling in microvias. The printing pressure is controlled at 3–8 N/cm² and the printing speed ranges from 20–80 mm/s, matched with a constant release speed of 0.1–0.3 mm/s to prevent solder paste stringing and peeling off. Supported by SPC (Statistical Process Control) for real-time printing status monitoring, the process can reduce the printing defect rate by more than 60%, making it suitable for mass large-scale production.

- The process integrates a full-link system consisting of front-end environment control, in-process parameter optimization and post-process intelligent inspection. Strict control over temperature and humidity in the production environment prevents solder paste from moisture absorption, drying and failure. Solder paste is replenished in small quantities and multiple batches, and the service life after opening is under strict control. Equipped with a 3D SPI solder paste inspector, it accurately detects issues such as solder bridging, voids and abnormal paste thickness to realize real-time interception of defective products.

- Optimized new-generation process can work with new toolings including nano-coated stencils and trapezoidal-aperture stencils. The 5nm Teflon coating reduces solder paste residue in microvias and cuts the bridging defect rate by 90%. In addition, it supports solder pastes of different particle sizes, satisfying mass production of ordinary circuit boards and customized production of high-end precision circuit boards.

II. Application Fields:

It is applied to consumer electronics, automotive electronics, industrial control and intelligent equipment, medical electronic devices, high-definition security equipment and other fields.

III. Customized Services:

Customized services including stencil and printing pattern customization, exclusive adaptation of process parameters, quality inspection and process optimization are available. Tailored solutions will be provided according to the distinct characteristics of customers’ products.