| Sensor Brand | STMicroelectronics |
| Shutter | GS |
| Camera Size | Supports rapid sample customization |
| Power | 2.8V/1.8V/1.15V |
| FOV | DFOV:20°-180°(Optional or customized) |
| IR Filter | Clear/650nm/850nm/940nm(Optional or customized) |
| Optical format | 1/4'' |
| Focus mode | Fixed Focus or Auto Focus |
| Color | RGB |
| Data Interface | MIPI 1 or 2Lane |
| Active Array Size | 1124*1364 |
| Pixel Size | 2.61 micron*2.61 micron |
| Max Frame rates | 88fps |
| Sensor Type | VD66GYCCA |
| Brand Name | Chippack |
| Model Number | VD66GYCCA |
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Product Specification
| Sensor Brand | STMicroelectronics | Shutter | GS |
| Camera Size | Supports rapid sample customization | Power | 2.8V/1.8V/1.15V |
| FOV | DFOV:20°-180°(Optional or customized) | IR Filter | Clear/650nm/850nm/940nm(Optional or customized) |
| Optical format | 1/4'' | Focus mode | Fixed Focus or Auto Focus |
| Color | RGB | Data Interface | MIPI 1 or 2Lane |
| Active Array Size | 1124*1364 | Pixel Size | 2.61 micron*2.61 micron |
| Max Frame rates | 88fps | Sensor Type | VD66GYCCA |
| Brand Name | Chippack | Model Number | VD66GYCCA |
| High Light | RGB Global Shutter Camera Module ,VD66GY Camera Module ,RGB Camera Module 1124x1364 | ||
ST VD66GY RGB Global Shutter Camera Module , Machine Vision , AR / VR , QR Code , Customization Services Available .
1. Basic parameters:
- Resolution: 1124 (H) x 1364 (V), 1.53MP uses excellent 3D stacking and STMicroelectronics patented process, and performs well in the visible light and near-infrared regions (850 nm or 940 nm).
- Pixel size: 2.61μm (H) × 2.61μm (V), combining the three advantages of low parasitic sensitivity (PLS), high quantum efficiency (QE) and low crosstalk.
- Optical format: 1/4 inch, this size of optical format ensures a certain light collection capacity while also making the sensor suitable for a variety of miniaturized devices.
- Power supply voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It can work stably under different voltage conditions, ensuring the reliability of the sensor.
- Temperature range: The operating temperature is -30℃ to 85℃, with a wide temperature operating range, which can adapt to different working environments.
2. Technical features:
- Global shutter technology: The global shutter design effectively eliminates motion blur and lighting artifacts, while reducing lighting power consumption requirements.
- Full pixel packaging technology is used to provide excellent photosensitivity and image sharpness in the visible to near-infrared spectrum range (such as 850 nm or 940 nm), and the ability to capture details is unparalleled.
- The chip is embedded with multiple image correction algorithms, which can automatically fix problems such as color deviation, noise and uneven brightness of the picture, ensuring high consistency in imaging.
- VD66GY RGB image sensor is available in three versions: 1.5 million pixel RGB-IR version (VD16GZ), 1.5 million pixel Mono version (VD56G3).
- VD66GY camera module: compatible with standard modules with different lens configurations such as 152° and 73°; meet different customer needs.
3. Application areas:
Used in virtual reality/augmented reality, biometrics, drones, smart homes, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.
4. Personalized customization service:
Customized modules can be customized according to customer needs, and tailor-made products that meet customers' needs.
Company Details
Business Type:
Manufacturer
Year Established:
2018 Year
Employee Number:
200~300
Ecer Certification:
Verified Supplier
Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a... Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a...
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