| IR Filter | Clear/650nm/850nm/940nm(Optional or customized) |
| Pixel Size | 2.61 micron*2.61 micron |
| Sensor Brand | ST |
| Optical format | 1/4'' |
| Focus mode | Fixed Focus or Auto Focus |
| Shutter | GS |
| Camera Size | Supports rapid sample customization |
| Power | Power Supply Voltage:2.8V/1.8V/1.15V |
| FOV | DFOV:20°-180°(Optional or customized) |
| Color | MONO |
| Data Interface | 1/2 Lane MIPI Interface |
| Active Array Size | 1124*1364 |
| Payment Terms | |
| Supply Ability | |
| Delivery Time | |
| Packaging Details | |
| Sensor Type | VD56G3CCA |
| Max Frame rates | 88 frames per second |
| Brand Name | Chippack |
| Model Number | VD56G3CCA |
| Place of Origin |
View Detail Information
Explore similar products
Global Shutter 49 Perspective MIPI Camera Module 1.53 MP With VD56G3CCA Sensor
ST VD66GY RGB Global Shutter Camera Module 1124x1364 For Barcode Scanning
VD55G0 ST Sensor MONO Global Shutter Camera Module 644x604 for Machine Vision
VD55G1 ST Sensor Global Shutter Camera Module I3C 800x700 for QR Code
Product Specification
| IR Filter | Clear/650nm/850nm/940nm(Optional or customized) | Pixel Size | 2.61 micron*2.61 micron |
| Sensor Brand | ST | Optical format | 1/4'' |
| Focus mode | Fixed Focus or Auto Focus | Shutter | GS |
| Camera Size | Supports rapid sample customization | Power | Power Supply Voltage:2.8V/1.8V/1.15V |
| FOV | DFOV:20°-180°(Optional or customized) | Color | MONO |
| Data Interface | 1/2 Lane MIPI Interface | Active Array Size | 1124*1364 |
| Payment Terms | Supply Ability | ||
| Delivery Time | Packaging Details | ||
| Sensor Type | VD56G3CCA | Max Frame rates | 88 frames per second |
| Brand Name | Chippack | Model Number | VD56G3CCA |
| Place of Origin | |||
| High Light | AR Global Shutter Camera Module ,Mono Global Shutter Camera Module ,ST VD56G3CCA | ||
ST VD56G3 MONO Global Shutter Camera Module , Machine Vision , AR / VR , QR Code , Customization Services Available .
1. Basic Parameters:
- Resolution: 1124 (H) × 1346 (V), 1.53MP. It can accurately capture subtle details in images and deliver outstanding imaging clarity.
- Pixel Size: 2.61μm (H) × 2.61μm (V). Adopting an advanced pixel architecture, it ensures high pixel density and compact imaging size while effectively boosting the light sensitivity of individual pixels, balancing imaging precision and light sensitivity.
- Optical Format: 1/4 inch. It features high compatibility with lenses and can flexibly meet imaging requirements for various fields of view.
- Supply Voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It operates stably under various voltage conditions to guarantee sensor reliability.
- Temperature Range: Operating temperature ranges from -30℃ to 85℃. The wide operating temperature range enables adaptation to diverse working environments.
2. Technical Features:
- Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption for lighting.
- Integrating four core technologies including global shutter, Back-Side Illumination (BSI), Continuous Digital Time Integration (CDTI) and 3D stacking, the sensor achieves ultra-high quantum efficiency in the visible light band as well as the 850nm and 940nm near-infrared bands. It delivers exceptional light sensitivity in low-light conditions and an excellent Modulation Transfer Function, producing sharp images with high detail restoration to meet the demands of high-precision visual inspection.
- Equipped with on-chip integrated image processing algorithms, it natively supports automatic exposure, defective pixel correction, pixel binning, image cropping, sub-sampling and other functions. Basic image quality optimization and parameter adjustment can be realized without an external image processing chip.
- VD56G3CCA Camera Module: Compatible with standard modules fitted with different lenses such as the 73° lens to satisfy diversified customer requirements.
3. Application Fields:
It is applied in virtual reality/augmented reality, biometric identification, unmanned aerial vehicles, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other sectors.
4. Personalized Customization Service:
Custom modules can be manufactured on demand to develop tailor-made products for customers.
Company Details
Business Type:
Manufacturer
Year Established:
2018 Year
Employee Number:
200~300
Ecer Certification:
Verified Supplier
Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a... Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a...
Get in touch with us
Leave a Message, we will call you back quickly!