SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4WEEKS |
| Maximum Substrate Size | ≤12 inches |
| Vacuum Level | ≤10⁻² Pa |
| Pressure Range | 0–5 MPa |
| Temperature Range | Ambient – 300 °C |
| Cycle Time | 5–60 min |
| Power Supply | 220V / 380V |
| Brand Name | ZMSH |
| Place of Origin | SHANGHAI,CHINA |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4WEEKS |
| Maximum Substrate Size | ≤12 inches | Vacuum Level | ≤10⁻² Pa |
| Pressure Range | 0–5 MPa | Temperature Range | Ambient – 300 °C |
| Cycle Time | 5–60 min | Power Supply | 220V / 380V |
| Brand Name | ZMSH | Place of Origin | SHANGHAI,CHINA |
| High Light | SiC wafer bonding machine ，precision graphite paper bonding equipment ，SiC seed semiconductor bonding tool | ||
The SiC Bonding Machine is a high-precision system designed to bond wafers, SiC seeds, graphite paper, and graphite plates. It provides accurate center alignment, vacuum-assisted bonding, and adjustable pressure, ensuring bubble-free, uniform, and stable bonding.
This machine is ideal for semiconductor manufacturing, SiC seed preparation, high-temperature ceramics, and research or pilot-scale applications. It offers a reliable, reproducible process for materials that require high precision and integrity.
High Bonding Precision: Accurate alignment guarantees uniform bonding across the substrate.
Bubble-Free Bonding: Vacuum-assisted bonding removes trapped air and prevents defects.
Adjustable Pressure: Ensures uniform compression for consistent bonding quality.
Material Compatibility: Supports wafers, SiC seeds, graphite paper, and graphite plates.
Stable and Reproducible Process: Ideal for small-batch or pilot-scale production.
User-Friendly Operation: Simple interface for easy control and process monitoring.
Center Alignment Mechanism: Precisely positions wafers, SiC seeds, and graphite plates.
Vacuum-Assisted Bonding: Eliminates air bubbles in the adhesive layer.
Adjustable Pressure System: Ensures uniform interface compression.
Programmable Process Parameters: Temperature, pressure, and dwell time can be set for specific materials.
Data Logging and Monitoring: Records process parameters for quality assurance.
Compact and Modular Design: Easy to integrate into existing workflows.
| Parameter | Specification | Notes |
|---|---|---|
| Maximum Substrate Size | ≤12 inches | Supports smaller wafers and substrates |
| Vacuum Level | ≤10⁻² Pa | Ensures bubble-free bonding |
| Pressure Range | 0–5 MPa | Adjustable for uniform compression |
| Temperature Range | Ambient – 300 °C | Optional heating for specific adhesives |
| Cycle Time | 5–60 min | Adjustable depending on substrate and process |
| Power Supply | 220V / 380V | Single or three-phase depending on installation |
| Motion Control | Manual or semi-automated | Allows precise alignment and bonding |
SiC Seed Bonding: High-precision bonding of SiC seeds to wafers or substrates.
Semiconductor Wafers: Bonding single or multi-layer wafers.
Graphite Substrates: Bonding graphite paper or plates for high-temperature applications.
R&D and Pilot Production: Small-batch or research-scale bonding.
High-Temperature Materials: Bonding ceramic or composite substrates.
Q1: What substrates can this bonding machine handle?
A1: Wafers, SiC seeds, graphite paper, and graphite plates, including rigid and flexible substrates.
Q2: How is bubble-free bonding achieved?
A2: Vacuum-assisted bonding removes trapped air, ensuring a defect-free adhesive layer.
Q3: Is the bonding pressure adjustable?
A3: Yes, pressure is adjustable from 0–5 MPa for uniform interface compression.
Q4: Can this machine support pilot-scale production?
A4: Yes, it is suitable for research, pilot-scale, and small-batch production.
Q5: Is the machine easy to operate?
A5: Yes, the system features a user-friendly interface and semi-automated alignment for easy operation.
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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