SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4 WEEKS |
| Wafer Size | 6–8 inch Silicon & SiC wafers |
| Equipment Dimensions | 13,643 × 5,030 × 2,300 mm (L × W × H) |
| Power Supply | AC 380 V, 50 Hz |
| Total Power Consumption | Approx. 119 kW |
| Mounting Flatness | ≤ 2 µm |
| Mounting Cleanliness | ≥0.5 µm < 50 ea, ≥5 µm < 1 ea |
| Brand Name | ZMSH |
| Place of Origin | SHANGHAI,CHINA |
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Product Specification
| Payment Terms | T/T | Delivery Time | 2-4 WEEKS |
| Wafer Size | 6–8 inch Silicon & SiC wafers | Equipment Dimensions | 13,643 × 5,030 × 2,300 mm (L × W × H) |
| Power Supply | AC 380 V, 50 Hz | Total Power Consumption | Approx. 119 kW |
| Mounting Flatness | ≤ 2 µm | Mounting Cleanliness | ≥0.5 µm < 50 ea, ≥5 µm < 1 ea |
| Brand Name | ZMSH | Place of Origin | SHANGHAI,CHINA |
| High Light | 6-8 inch silicon wafer polishing line ，SiC wafer polishing with quad heads ，closed-loop mounting semiconductor polishing equipment | ||
The 6–8 inch Semiconductor Wafer Polishing Automation Line is a fully integrated post-polishing production system designed for silicon and silicon-carbide (SiC) wafers.
It combines quad-head polishing, automatic wafer de-mounting, ceramic carrier management, precision cleaning, and high-accuracy wafer re-mounting into a single closed-loop automation platform.
This system enables continuous, contamination-controlled, high-yield wafer processing, making it ideal for power semiconductor fabs, SiC substrate manufacturers, and advanced packaging wafer lines.
The entire line consists of four highly coordinated process modules:
After quad-polishing, wafers are automatically separated from ceramic carriers using low-stress, controlled motion algorithms, preventing:
Edge chipping
Micro-cracks
Residual stress damage
This is especially critical for brittle and high-value SiC wafers.
Ceramic carriers are automatically sorted, stored, and dispatched.
The buffer system allows:
Continuous operation of the polishing line
Multi-spec carrier compatibility
Stable takt time control
This eliminates production interruptions caused by manual handling or carrier shortage.
Before re-mounting, each ceramic carrier undergoes deep-level precision cleaning to remove:
Polishing slurry
Sub-micron particles
Chemical residues
This ensures a repeatable, contamination-free surface for every new wafer mounting cycle.
Wafers are mounted onto cleaned carriers with:
Controlled pressure
Sub-micron alignment
Ultra-high flatness control
This provides the ideal initial condition for the next quad-polishing step, directly improving polishing uniformity and final wafer quality.
Mounting area cleanliness:
≥ 0.5 µm particles: < 50 ea
≥ 5 µm particles: < 1 ea
Fully compliant with advanced power semiconductor and SiC manufacturing standards.
Mounting flatness ≤ 2 µm
This ensures:
Uniform polishing pressure
Stable material removal rates
Superior thickness uniformity
Critical for high-performance power devices and advanced packaging wafers.
| Wafer Size | Carrier Diameter | Wafers per Carrier | Cycle Time |
|---|---|---|---|
| 6 inch | 485 mm | 6 wafers | 3 min / carrier |
| 6 inch | 576 mm | 8 wafers | 4 min / carrier |
| 8 inch | 485 mm | 3 wafers | 2 min / carrier |
| 8 inch | 576 mm | 5 wafers | 3 min / carrier |
The system allows manufacturers to balance throughput, cost, and surface quality based on their production strategy.
Wafer Size: 6–8 inch Silicon & SiC wafers
Equipment Dimensions: 13,643 × 5,030 × 2,300 mm (L × W × H)
Power Supply: AC 380 V, 50 Hz
Total Power Consumption: Approx. 119 kW
Mounting Flatness: ≤ 2 µm
Mounting Cleanliness:
≥0.5 µm < 50 ea, ≥5 µm < 1 ea
Si and SiC power semiconductor wafers (MOSFET, IGBT, diodes)
SiC substrates and epitaxial wafers
Advanced packaging and interposer wafers
Precision device-grade polished wafers
24/7 remote and on-site technical support
Response within 2 hours
On-site arrival: within 24 hours (local) / 36 hours (non-local)
Free warranty repair and service
Lifetime maintenance and spare-parts support
Critical spare parts always in stock
Regular preventive maintenance visits by field engineers
Yes. The system is specifically optimized for both silicon and silicon-carbide wafers. Motion profiles, mounting pressure, and de-mounting trajectories are tuned to handle the high hardness and brittleness of SiC safely.
By combining ultra-clean carriers, high flatness mounting, and fully automated handling, the system minimizes:
Particle contamination
Wafer warpage
Pressure non-uniformity
This leads to more stable polishing, lower breakage rates, and higher wafer yield.
Yes. The carrier buffer and automated logistics are designed to allow 24/7 continuous operation, keeping the quad-polisher running without waiting for manual loading or cleaning.
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widel...
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