High Density Air Coil Inductor 48nH Air Core Coil Inductor 200mA

Product Specification

HALA2000303R High-Density 20-Turn Air Core Inductor | 48nH 200mA Broadband RF Choke

High-Inductance Microwave Abstract
   The HALA2000303R represents the pinnacle of high-density micro-winding technology, engineered for high-performance microwave and RF systems requiring elevated inductance in a sub-millimeter footprint. This precision-wound 20-turn micro air core inductor utilizes an ultra-fine 0.03 mm (30 µm) high-purity enameled copper wire. By packing 20 turns within a miniature 0.3 mm (300 µm) hollow inner core, it delivers an impressive nominal inductance of 48 nH ± 20%.

   Operating reliably across a broad frequency spectrum of 1.0 GHz to 18.0 GHz, the HALA2000303R provides exceptional blocking impedance at lower microwave bands (down to 1 GHz), making it an outstanding multi-octave bias tee and filter element. The coreless design guarantees absolute electromagnetic linearity with zero magnetic saturation, hysteresis losses, or thermal permeability drifts under extreme operating temperatures ranging from -55°C to +125°C.

Key Performance Capabilities
   Maximum Inductance Density: Achieves a high 48nH inductance within a microscopic profile, maximizing board-space utilization in dense RF front-ends.
   Multi-Octave Broadband Blocking: Extends down to 1.0 GHz, providing wideband noise suppression and isolation across L, S, C, X, and Ku microwave bands.
   Zero Core Distortion: Pure air-core construction ensures absolute signal linearity and zero magnetic saturation, which is critical for high-purity transmitter paths.
   Precision Solderability: Features pre-stripped and pre-tinned termination leads, fully compatible with precision lead-bonding and microscopic hand-soldering.

Engineering Datasheet Specifications
   •Nominal Inductance: 48 nH (±20% Tolerance)
   •Maximum Continuous Current: 200 mA (Continuous DC)
   •Recommended Operating Frequency: 1.0 - 18.0 GHz (Broadband RF)
   •Helical Winding turns: 20 Turns (High-Density)
   •Copper Conductor Diameter: 0.03 mm (30 µm)
   •Hollow Inner Diameter: 0.30 mm (300 µm)
   •Lead Finish: Pre-tinned (Solder-ready preparation)
   •Winding Material: Enameled Copper (High-reliability grade)
   •Assembly Compatibility: Micro-Soldering & Bonding (Optimized for lead bonding)
   •Rated Operating Temperature: -55 to +125 °C (Industrial/Tactical Grade)
   •Storage Environment: 20-25°C, 40%-60% RH (Moisture-controlled cleanroom)
   •Shelf Life Guarantee: 1 Year (Under Storage Conditions)

Product Dimensions

S-Parameter Optimization & High-Density Assembly Guide
   Given the extremely high turn density and ultra-fine 30-micron wire of the HALA2000303R, strict layout and thermal protocols are mandatory during PCB integration:

6.1 Orthogonal Fields Decoupling
   To eliminate parasitic mutual inductive coupling, the central longitudinal axis of the HALA2000303R coil body must be positioned strictly perpendicular (90-degree orthogonal) to the primary RF microstrip signal trace. Parallel placement acts as an accidental transformer, distorting S-parameters.

6.2 Parasitic Stub Mitigation
   Trimming the connecting leads from the winding body to the PCB signal pads to the absolute shortest length possible is critical. Any excess lead length functions as an unplanned series inductor, lowering the self-resonant frequency (SRF) out of the targeted 1-18 GHz operating band.

6.3 Micro-Soldering SOP for Fragile Filament
   •Handling: Due to the microscopic 0.03mm wire diameter, manual positioning must be done under a minimum 10x stereo inspection microscope using non-magnetic, fine-point ceramic tweezers.
   •Thermal Budgeting: Soldering iron tip or hot-air reflow temperatures must be strictly capped at 260°C for a maximum duration of 3 seconds. Overheating will immediately compromise the ultra-thin enameled insulation or sever the copper core.
   •Pitch Stabilization: Once RF tuning and S-parameter checks are completed, apply a tiny droplet of low-loss dielectric epoxy to lock the 20 turns. This protects the dense coil pitch from vibration-induced detuning and microphonics.

Comparative Analysis
   This technical trade-off matrix helps design engineers select the optimal part based on power and frequency needs within Vibratac's micro-coil portfolio:

   •HALA2000303R (This Model): 20 Turns | 0.03 mm Wire | 48 nH Inductance | 200 mA Current. Best for: Low-frequency blocking (1 GHz+) and maximum inductance density.
   •HALA1200503R: 12 Turns | 0.05 mm Wire | 17 nH Inductance | 400 mA Current. Best for: Double the current handling capacity and higher K-band frequency response (up to 20 GHz).
   •HALA1200303R: 12 Turns | 0.03 mm Wire | 26 nH Inductance | 200 mA Current. Best for: Balanced high-Q matching in mid-frequency microwave bands (1.5 - 18 GHz).

Test Data