| Capacitance | 10nF |
| Temperature Coefficient | X7R |
| Tolerance | ±10% |
| Voltage Rating | 50V |
| Number of Capacitors | 4 |
| Description | 10nF X7R ±10% 50V 0612 Capacitor Networks, Arrays RoHS |
| Mfr. Part # | 6124B103K500NT |
| Package | 0612 |
| Model Number | 6124B103K500NT |
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Product Specification
| Capacitance | 10nF | Temperature Coefficient | X7R |
| Tolerance | ±10% | Voltage Rating | 50V |
| Number of Capacitors | 4 | Description | 10nF X7R ±10% 50V 0612 Capacitor Networks, Arrays RoHS |
| Mfr. Part # | 6124B103K500NT | Package | 0612 |
| Model Number | 6124B103K500NT |
The MLCC Arrays (C-ARRAY SERIES) offer a space-saving solution for PCB designs, consolidating four 0603-sized capacitors into a single unit. This design enhances assembly density, reduces component count, and improves manufacturing efficiency, leading to cost savings. They are suitable for SMT processes and are ideal for space-constrained applications like notebook computers, PDAs, and I/O interface circuits.
| Model Code | Product Size (L x W, inch) | Elements Inside | Dielectric Style | Nominal Capacitance (pF) | Capacitance Tolerance | Rated Voltage (V) | Terminal Material | Package Style | Temperature Coefficient / Characteristics |
| 6124 | 0.06 x 0.12 | 4 | COG | 0.5 to 1000 | J (5%), K (10%), M (20%) | 16, 25, 50, 100 | S, C, N | B, T | 030 ppm/ (-55125) |
| 6124 | 0.06 x 0.12 | 4 | X7R | 100 to 220nF | K (10%), M (20%), Z (+80%/-20%) | 16, 25, 50, 100 | S, C, N | B, T | 15% (-55125) |
| 6124 | 0.06 x 0.12 | 4 | Y5V | 100 to 220nF | Z (+80%/-20%) | 16, 25, 50 | S, C, N | B, T | -80%+30% (-2585) |
| 5084 | 0.05 x 0.08 | 4 | COG | 0.5 to 1000 | J (5%), K (10%), M (20%) | 16, 25, 50 | S, C, N | B, T | 030 ppm/ (-55125) |
| 5084 | 0.05 x 0.08 | 4 | X7R | 100 to 220nF | K (10%), M (20%), Z (+80%/-20%) | 16, 25, 50 | S, C, N | B, T | 15% (-55125) |
| 5084 | 0.05 x 0.08 | 4 | Y5V | 100 to 220nF | Z (+80%/-20%) | 16, 25, 50 | S, C, N | B, T | -80%+30% (-2585) |
| 5082 | 0.05 x 0.08 | 2 | COG | 0.5 to 1000 | J (5%), K (10%), M (20%) | 16, 25, 50 | S, C, N | B, T | 030 ppm/ (-55125) |
| 5082 | 0.05 x 0.08 | 2 | X7R | 100 to 220nF | K (10%), M (20%), Z (+80%/-20%) | 16, 25, 50 | S, C, N | B, T | 15% (-55125) |
| 5082 | 0.05 x 0.08 | 2 | Y5V | 100 to 220nF | Z (+80%/-20%) | 16, 25, 50 | S, C, N | B, T | -80%+30% (-2585) |
| Item | Technical Specification | Test Method and Remarks |
| Capacitance | Class I: Within specified tolerance. Class II: Within specified tolerance. | Class I: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms. Class II: C10F: 1KHz10%, 1.00.2Vrms; C10F: 12024 Hz, 0.50.1Vrms. Test Temp: 253. |
| Dissipation Factor (DF, tan) | Class I: 0.56% (Cr5pF); 1.5[(150/Cr)+7]10-4 (5pFCr50pF); 0.15% (50pFCr1000pF); 0.15% (>1000pF). Class II (X7R): 2.5% (50V); 3.5% (25V); 5.0% (16V); 5.0% (10V); 7.5% (6.3V). Class II (Y5V): 7.0% (25V, C3.3F); 10.0% (25V, C3.3F); 15% (16V); 15% (10V); 15% (6.3V). | Class I: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms. Class II: C10F: 1KHz10%, 1.00.2Vrms; C10F: 12024 Hz, 0.50.1Vrms. |
| Insulation Resistance (IR) | Class I: C10 nF, Ri50000M; C10 nF, Ri CR500S. Class II (X7R): C25 nF, Ri10000M; C25 nF, Ri CR100S. Class II (Y5V): C25 nF, Ri4000M; C25 nF, Ri CR100S. | Test Voltage: Rated Voltage; Duration: 605s; Humidity: 75%; Temp: 253; Current: 50mA. |
| Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated Voltage; Class II: 250% Rated Voltage. Duration: 15s. Current: 50mA max. |
| Solderability | At least 95% of terminal electrode covered by new solder. Appearance: No visible damage. | Preheating: 80-120, 10-30s. Lead solder: 2355, 20.5s. Lead-free solder: 2455, 20.5s. |
| Resistance to Soldering Heat | C/C: COG 0.5%; X7R -5%~+10%; Y5V -10%~+20%. DF & IR: Same to initial standard. Appearance: No visible damage. Solder coverage: 95%. | Preheating: 100-200, 102min. Solder Temp: 2655, Duration: 101s. Recovery: 242h at room temp. |
| Resistance to Flexure of Substrate | C/C 10%. Appearance: No visible damage. | Test Board: Al2O3 or PCB. Warp: 1mm. Speed: 1mm/sec. Measurement in bending state. |
| Termination Adhesion | No visible damage. | Applied Force: 5N. Duration: 101S. |
| Temperature Cycle | C/C: Class I: 1% or 1pF (whichever is larger); Class II (B): 10%; Class II (F): 20%. | 5 cycles: -55(30min)+20(2-3min)+125(30min)+20(2-3min). Recovery: 242h. (Y5V/Z5U limits: -25, +85). |
| Humidity Load | C/C: Class I: 7.5% or 0.75pF (whichever is larger); Class II (B): 12.5%; Class II (F): 30%. DF 2x initial. IR: Class I 5000M or Ri CR50S (whichever is smaller); X7R 1000M or Ri CR10S (whichever is smaller); Y5V 400M or Ri CR10S (whichever is smaller). Appearance: No visible damage. | Temp: 402, Humidity: 90-95%RH, Voltage: Rated Voltage, Duration: 500h. Recovery: 24h (Class 1), 48h (Class 2) at room temp. |
| Life Test | C/C: Class I: 2% or 1pF (whichever is larger); Class II (B): 20%; Class II (F): 30%. DF 2x initial. IR: Class I 4000M or Ri CR40S (whichever is smaller). | Voltage: 2x Rated Voltage, Duration: 1000h. Temp: 125 (NPO, X7R), 85 (Y5V). Current: 50mA max. Recovery: 24h (Class 1), 48h (Class 2) at room temp. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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