Beijing Silk Road Enterprise Management Services Co., Ltd.
| Operating Temperature | -55℃~+125℃ |
| Nominal Capacitance | 100nF |
| Voltage Rating | 50V |
| Tolerance | ±20% |
| DC Resistance(DCR) | 3mΩ |
| Current Rating | 6A |
| Description | 100nF ±20% 3mΩ SMD-3P,1.6x3.2mm Feed Through Capacitors RoHS |
| Mfr. Part # | NFM31HK104R1H3L |
| Package | SMD-3P,1.6x3.2mm |
| Model Number | NFM31HK104R1H3L |
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Product Specification
| Operating Temperature | -55℃~+125℃ | Nominal Capacitance | 100nF |
| Voltage Rating | 50V | Tolerance | ±20% |
| DC Resistance(DCR) | 3mΩ | Current Rating | 6A |
| Description | 100nF ±20% 3mΩ SMD-3P,1.6x3.2mm Feed Through Capacitors RoHS | Mfr. Part # | NFM31HK104R1H3L |
| Package | SMD-3P,1.6x3.2mm | Model Number | NFM31HK104R1H3L |
The MURATA NFM31HK104R1H3 is a Very Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor designed for EMI filtering in automotive electronic equipment. It offers low ESL and high current handling capabilities, making it suitable for demanding applications.
| Part Number | Capacitance | Capacitance Tolerance | Rated Voltage | Rated Current | DC Resistance (max.) | Operating Temperature Range | Storage Temperature Range | Package Size Code | Packaging | Standard Packing Quantity |
| NFM31HK104R1H3 | 0.1F | +/-20% | DC 50V | DC 6A | 3m | -55 to 125 | -55 to 125 | 3216M(1206) | 180mm Reel Plastic Tape (W8P4) | 3000 pcs./Reel |
| Test Item | Specification | Test Method (Ref. Standard: AEC-Q200) |
| Resistance to Soldering Heat | Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below | Solder bath method: Sn-3.0Ag-0.5Cu (Lead Free Solder), 270+/-5, 10+/-1s |
| Vibration | Appearance: No defects or abnormalities. Capacitance: Within the specified initial value. DC Resistance: 50m below | Simple harmonic motion 10Hz to 2000Hz to 10Hz, Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller, 20min per direction, 3 directions |
| Mechanical Shock | Appearance: No defects or abnormalities. Capacitance: Within the specified initial value. DC Resistance: 50m below | Half-sine waveform, Peak value 1500g, Holding Time 0.5ms, Velocity change 4.7m/s, 3 shocks per direction, 3 directions |
| Operational Life | Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M | Mounting method: Solder on test substrate. Test Temperature: Maximum Operating Temperature +/-3. Test Time: 1000+/-12h. Test Voltage: 100% of the rated voltage. |
| Biased Humidity | Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M | Mounting method: Solder on test substrate. Test Temperature: 85+/-3. Test Humidity: 80%RH to 85%RH. Test Time: 1000+/-12h. Test Voltage: Rated voltage and 1.3+0.2/-0Vdc (add 6.8k resister). |
| Temperature Cycling | Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below I.R. (Room Temp.): Within the specified initial value. | Mounting method: Solder on test substrate. Cycles: 1000 cycles. |
| High Temperature Exposure (Storage) | Appearance: No defects or abnormalities. Capacitance Change: Within +/-12.5% DC Resistance: 50m below I.R. (Room Temp.): More than 50M | Mounting method: Solder on test substrate. Test Temperature: Maximum Operating Temperature +/-3. Test Time: 1000+/-12h. |
| Terminal Strength | Appearance: No defects or abnormalities. | Applied Force: 9.8N, Holding Time: 30s |
| Board Flex | Appearance: No defects or abnormalities. Capacitance Change: Within +/-7.5% DC Resistance: 50m below | Mounting method: Reflow solder on test substrate. Flexure: 1mm, Holding Time: 30s |
| Voltage proof | Appearance: No defects or abnormalities. DC Resistance: Shown in Rated value. | Test Voltage: 300% of the rated voltage, Applied Time: 1s to 5s |
| Insulation Resistance(I.R.) (Room Temperature) | More than 1000M | Measurement Voltage: Rated Voltage, Charging Time: 2min |
| Solderability | 95% of the terminations is to be soldered evenly and continuously. | Pre-treatment: Heat treatment at 155C for 4 hours. Flux: Rosin ethanol 25(mass)%. Solder: Sn-3.0Ag-0.5Cu (Lead Free Solder) at 245+/-5 . |
| Beam Load Test | Destruction value: More than 14.7N | Speed supplied the Stress Load: 0.5mm/s |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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