| Nominal Capacitance | 2.2uF |
| Operating Temperature | -40℃~+85℃ |
| Voltage Rating | 10V |
| Tolerance | ±20% |
| DC Resistance(DCR) | 10mΩ |
| Current Rating | 4A |
| Description | 2.2uF ±20% 10mΩ SMD-3P,1.6x0.8mm Feed Through Capacitors RoHS |
| Mfr. Part # | NFM18PC225B1A3D |
| Package | SMD-3P,1.6x0.8mm |
| Model Number | NFM18PC225B1A3D |
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Product Specification
| Nominal Capacitance | 2.2uF | Operating Temperature | -40℃~+85℃ |
| Voltage Rating | 10V | Tolerance | ±20% |
| DC Resistance(DCR) | 10mΩ | Current Rating | 4A |
| Description | 2.2uF ±20% 10mΩ SMD-3P,1.6x0.8mm Feed Through Capacitors RoHS | Mfr. Part # | NFM18PC225B1A3D |
| Package | SMD-3P,1.6x0.8mm | Model Number | NFM18PC225B1A3D |
The NFM18PC225B1A3 is a Chip EMIFIL Chip 3-terminal Capacitor designed for large current applications in general electronic equipment. It offers a capacitance of 2.2uF and a DC rated voltage of 10V, with a rated current of 4A (DC).
| Item | Specification | Test Method |
|---|---|---|
| Capacitance | 2.2 uF | Frequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms) |
| Capacitance Tolerance | 20 % | |
| DC Rated Voltage | 10 V | Rated Voltage x 300% Time : 1 to 5 s |
| Rated Current | 4A(DC) | |
| DC Resistance | 10mmax. | Measured with 100mA max. |
| Insulation Resistance | 0.250.1 200Mmin. | Voltage : Rated Voltage Time : 2 minutes max. |
| Operating Temperature Range | -40 to 85 C | |
| Storage Temperature Range | -40 to 85 C | |
| Dimensions (L x W x T) | 1.60.1 x 0.80.1 x 0.80.1 mm | |
| Appearance | No defects or abnormalities. | Visual inspection. |
| Solderability | Electrodes shall be at least 90% covered with new solder coating. | Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 240 3C. Immersion Time: 31 s. |
| Resistance to soldering heat | Appearance No damaged, Cap. Change Within 7.5%, DC Resistance 0.05 max. | Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 270 5C. Immersion Time: 10 1 s. |
| Bending Strength | Deflection 2 mm, Keeping Time 30 s | Soldered on glass-epoxy substrate (100401.0mm). |
| Drop | Height: 1m, Method: Free fall, Attitude: 3 directions | Dropped on concrete or steel board. |
| Bonding Strength | Applying Force (F): 9.8 N, Applying Time: 10 s | Soldered on glass-epoxy substrate. |
| Vibration | Oscillation Frequency: 10 to 2000 to 10Hz for 20 minute. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time: 2 hours in each of 3 mutually perpendicular directions. | Soldered on glass-epoxy substrate. Preconditioning: Heat treatment (150+0 / -10 C,1hour). |
| Temperature Cycling | -55C (30 min) to +125C (30 min) per cycle, 10 cycles | Soldered on glass-epoxy substrate. |
| Humidity | 402C, 90 to 95%(RH), 500 hours | Soldered on glass-epoxy substrate. |
| Heat Life | Maximum Operating Temperature 2 C, Rated Voltage x 200%, 1000 hours | Soldered on glass-epoxy substrate. |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification:
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
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