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Beijing Silk Road Enterprise Management Services Co., Ltd.

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China High attenuation and low insertion loss Chilisin BTLB0020123G6H6A10 SMD
China High attenuation and low insertion loss Chilisin BTLB0020123G6H6A10 SMD

  1. China High attenuation and low insertion loss Chilisin BTLB0020123G6H6A10 SMD

High attenuation and low insertion loss Chilisin BTLB0020123G6H6A10 SMD

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Impedance 50Ω
Insertion Loss 1.8dB
Description 1.8dB 0805 RF Filters RoHS
Mfr. Part # BTLB0020123G6H6A10
Package 0805
Model Number BTLB0020123G6H6A10

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  1. Product Details
  2. Company Details

Product Specification

Impedance 50Ω Insertion Loss 1.8dB
Description 1.8dB 0805 RF Filters RoHS Mfr. Part # BTLB0020123G6H6A10
Package 0805 Model Number BTLB0020123G6H6A10

Product Overview

The Chilisin BTLB0020123G6H6A10 is a miniaturized SMD component designed for high-frequency and space-limited applications, including WLAN, Bluetooth, and Home RF. It features a compact, low-profile, and lightweight design with internal shielding. This component offers low insertion loss and high attenuation across a wide frequency range, making it ideal for noise elimination. Its high soldering heat resistance supports both flow and re-flow soldering methods, and it is available in tape and reel packaging for automatic mounting.

Product Attributes

  • Brand: Chilisin
  • RoHS & Halogen Free & REACH Compliance
  • Packaging: Tape and reel for automatic mounting

Technical Specifications

Part Number Pass Band Insertion Loss in BW VSWR In BW Attenuation Operating Temperature Range Power Capacity
BTLB0020123G6H6A10 3300~3900 MHz 1.8 dB max. 2 max. 15 dB min. at 100~2600 MHz
20 dB min. at 6000~9000 MHz
-40~85C 3W max.

Dimensions

Dimension Value (mm)
L (a) 2.000.15
W (b) 1.250.15
T (c) 0.950.10
Height (d) 1.60+0.10 -0.15
Terminal (e) 0.30+0.10 -0.15
Terminal (f) 0.300.20
Terminal (g) 0.300.20

Mechanical & Environmental Tests

Test Item Test Condition Specification
Vibration 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions No apparent damage
Drop shock Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. No apparent damage
Soldering heat resistance Preheating temperature: 15010 (1-2 min), Solder bath temperature: 2605 (50.5 sec) No apparent damage
Bending test onto printed circuit board Apply load until bending reaches 2 mm on recommended PCB pattern. No apparent damage
Solderability Dipped in solder bath of 2455 for 30.5 seconds. At least 75% covered with solder.
Thermal shock -40~85 for 100 cycles (30 min each cycle) No apparent damage; Fulfill electrical spec. after test
Humidity resistance 852, 80~90% R.H. for 500 hours No apparent damage; Fulfill electrical spec. after test
High temperature resistance 852 for 500 hours No apparent damage; Fulfill electrical spec. after test
Low temperature resistance -403 for 500 hours No apparent damage; Fulfill electrical spec. after test

Taping Specifications

Series PCS/Reel A (mm) B (mm) C (mm) D (mm) E (mm) F (mm)
5824 5000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
5724 3000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
5320 1000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
5220 2000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
4532 2500 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
4516 3000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
3225 4000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
3216 10000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
2520 5000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
2012 3000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
1608 1000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
1109 2000 1781 60+0.5 -0 130.2 90.5 120.5 8 mm
1005 2500 1781 60+0.5 -0 130.2 90.5 120.5 8 mm

Reel Dimensions

No. of Reels W (cm) L (cm) H (cm)
2 180.5 180.5 2.40.2
3 180.5 180.5 3.60.2
4 180.5 180.5 4.80.2
5 180.5 180.5 6.00.2

Important Notes

  • Operating Temperature: -40~85
  • Recommended Storage Conditions: Temperature within -40~85 and humidity less than 75% RH.
  • Shelf Life: Product should be used within 6 months from the time of delivery.
  • PCB Design: Design PCB to prevent mechanical stress from board wrapage. Locate products in the sideway direction to mechanical stress. Products (A,B,C,D) should be located carefully to avoid stress due to board warping, as stress can be applied in the order of A>C>BD.

2410121527_Chilisin-BTLB0020123G6H6A10_C2981218.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    >>300

  • Ecer Certification:

    Verified Supplier

Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...

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Get in touch with us

  • Reach Us
  • Beijing Silk Road Enterprise Management Services Co., Ltd.
  • 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
  • https://www.icpassive.com/

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