Shenzhen Jiaqing Circuit Co., Ltd.
| Surface Finish | ENIG, ENEPIG, OSP |
| Rohs compliance | Yes |
| Solder mask color | Green / Blue / Red / Black / White |
| Payment Terms | L/C, D/A, D/P, T/T |
| Product name | IC Substrate Board |
| Minimum spacing | 2 mil (0.05mm) |
| Board size | Customizable up to 500mm x 500mm |
| Via type | Blind, Buried, Through-hole |
| Delivery Time | 5-15 working days, rush orders available |
| Layer Count | 2 – 18 layers |
| Minimum line width | 2 mil (0.05mm) |
| Via Diameter | 50 – 100 μm |
| Operating temperature | -40°C to 150°C |
| Core Thickness | 40 – 200 μm |
| Supply Ability | 20000 Sq.m / Month |
| Material | BT Resin / FR4 / Ceramic |
| Application | IC packaging, semiconductor devices |
| Packaging Details | Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes |
| Surface finish | ENIG / HASL / OSP |
| Model Number | BT Resin PCB IC Substrate, BGA Packaging Substrate |
| Certification | ISO9001 |
| Brand Name | JQPCB |
| Place of Origin | China |
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Product Specification
| Surface Finish | ENIG, ENEPIG, OSP | Rohs compliance | Yes |
| Solder mask color | Green / Blue / Red / Black / White | Payment Terms | L/C, D/A, D/P, T/T |
| Product name | IC Substrate Board | Minimum spacing | 2 mil (0.05mm) |
| Board size | Customizable up to 500mm x 500mm | Via type | Blind, Buried, Through-hole |
| Delivery Time | 5-15 working days, rush orders available | Layer Count | 2 – 18 layers |
| Minimum line width | 2 mil (0.05mm) | Via Diameter | 50 – 100 μm |
| Operating temperature | -40°C to 150°C | Core Thickness | 40 – 200 μm |
| Supply Ability | 20000 Sq.m / Month | Material | BT Resin / FR4 / Ceramic |
| Application | IC packaging, semiconductor devices | Packaging Details | Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes |
| Surface finish | ENIG / HASL / OSP | Model Number | BT Resin PCB IC Substrate, BGA Packaging Substrate |
| Certification | ISO9001 | Brand Name | JQPCB |
| Place of Origin | China |
Our BT resin IC substrate (Bismaleimide Triazine substrate) is a high-performance packaging substrate specially designed for BGA, CSP and advanced semiconductor chip packaging applications.
BT material features ultra-high Tg, excellent thermal stability, low thermal expansion coefficient and reliable dielectric performance, ideal for high-density fine pitch interconnection of semiconductor packages.
✅ High Tg BT Resin substrate, Tg＞250℃, outstanding heat resistance
✅ Fine pitch fabrication capability: Min line width 3mil (0.075mm), Min spacing 2mil (0.05mm)
✅ Advanced via technology: Blind via, buried via & through-hole available, via diameter down to 50μm
✅ Multiple surface finish: ENIG, ENEPIG, OSP for different chip bonding requirements
✅ Customizable layers: 2~12 layers, core thickness from 40μm to 200μm
✅ RoHS compliant, ISO9001 certified
✅ Prototype & mass production available, small MOQ accepted
IC packaging, BGA packaging, CSP, semiconductor devices, high-density microelectronic modules.
JQPCB is a professional manufacturer for high-end PCB & IC substrates. We provide one-stop service from Gerber review, prototype trial to volume mass production. Send us your Gerber files and specs for quotation.
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
20000000-50000000
Employee Number:
201~300
Ecer Certification：
Verified Supplier
Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs. We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcin... Jiaqing Circuit was founded in 2012 in Shenzhen, China. We own a 5,000 square meter manufacturing plant with a monthly PCB production capacity of 20,000 square meters, capable of manufacturing 2-48 layer PCBs. We deliver one-stop solutions including PCB design, PCB fabrication, BOM component sourcin...
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