Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces/month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
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Product Specification
| Supply Ability | 100,000 pieces/month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | Quality BGA Assembly ，BGA Assembly 100% X Ray Inspection | ||
Quality in BGA assembly is defined by what you cannot see—the solder joints hidden beneath the component body. Studio Electronics offers Quality BGA Assembly with 100% X-Ray inspection on every board. As a premier provider of PCB assembly in China, we combine specialized BGA process expertise with advanced 2D and 3D X-Ray systems to verify every solder joint. Our complete turnkey service covers component procurement through final shipping, with uncompromising quality verification at every stage.
| Inspection Parameter | What We Detect | Acceptance Criteria |
|---|---|---|
| Ball Alignment | Misaligned or offset balls | All balls aligned to pads within specification |
| Bridging | Solder bridges between adjacent balls | No electrical shorts; minimum spacing maintained |
| Missing Balls | Absent or misplaced balls | All balls present; correct ball count verified |
| Voids | Internal voids within solder balls | Void ratio <15% per ball (IPC Class 2/3) |
| Cold Solder | Poor wetting or incomplete soldering | All joints show proper wetting; no cold joints |
| Head-in-Pillow | Incomplete ball-to-pad connection | Detected through 3D X-Ray analysis |
Stage 1: Component Sourcing & Incoming Inspection
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Incoming inspection verifies component integrity and BGA ball condition.
Stage 2: Solder Paste Application
3D SPI verifies paste volume, height, and area. Real-time feedback ensures consistent deposition.
Stage 3: Precision BGA Placement
12 SMT lines with advanced BGA placement. Vision systems ensure accurate alignment. ±25μm placement accuracy.
Stage 4: Controlled Reflow
Custom reflow profiles optimized per BGA type. Closed-loop temperature control; nitrogen reflow option.
Stage 5: 100% X-Ray Inspection
Stage 6: Electrical Testing & Final Verification
ICT; Flying Probe; FCT. AOI for visible components. Reliability lab testing available.
Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics with tracking.
| BGA Quality Risk | Visual Inspection | Studio's X-Ray Solution |
|---|---|---|
| Hidden voids | Cannot detect | 3D X-Ray; automated void analysis |
| Head-in-pillow defects | Cannot detect | 3D X-Ray; precise joint analysis |
| Ball bridging | Cannot detect | 2D X-Ray; ball spacing verification |
| Cold solder joints | Cannot detect | X-Ray; solder wetting evaluation |
| Missing balls | Cannot detect | X-Ray; ball count verification |
Studio delivers Quality BGA Assembly—100% X-Ray inspection on every board, every BGA, every ball.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Leading PCB Assembly & Turnkey Manufacturing Services in China Studio is a premier electronics manufacturing service (EMS) provider in China, specializing in low volume PCB assembly and high-mix production. As an intelligent factory, we excel in one-stop turnkey solutions—from engineeri... Leading PCB Assembly & Turnkey Manufacturing Services in China Studio is a premier electronics manufacturing service (EMS) provider in China, specializing in low volume PCB assembly and high-mix production. As an intelligent factory, we excel in one-stop turnkey solutions—from engineeri...
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