Studio Technology Co., Ltd.
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Supply Ability | 100,000 pieces per month |
| Payment Terms | T/T |
| Place of Origin | China |
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Product Specification
| Packaging Details | ESD Protective Packaging/Customization | Delivery Time | 5-25 working days(varies by product) |
| Supply Ability | 100,000 pieces per month | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | Small Volume PCB Assembly BGA ，PCB Assembly BGA Prototype ，BGA Prototype Circuit Board Manufacturing | ||
BGA projects often start small—prototype validation, pilot production, market testing—before scaling to volume. Studio Electronics offers Low-Volume BGA Assembly supporting every stage from prototype through production. As a versatile provider of PCB assembly in China, we apply the same specialized BGA expertise—process optimization, X-Ray verification, and quality control—to every quantity, from 1 board to production volumes. Our 12 automated SMT lines and advanced inspection deliver reliable BGA assemblies throughout your product lifecycle.
| Production Stage | Typical Quantity | Studio Capability |
|---|---|---|
| Prototype | 1-10 boards | 100% X-Ray; Flying Probe; expedited options |
| Pilot Run | 10-50 boards | Full SMT capability; 100% X-Ray; ICT; FCT |
| Small Batch | 50-250 boards | Efficient production; competitive pricing |
| Volume Production | 250+ boards | 12 SMT lines; scalable capacity |
Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported with competitive pricing.
Stage 2: SMT Assembly
12 SMT lines with quick-changeover. BGA placement with ±25μm accuracy. Vision alignment ensures accurate ball-to-pad registration.
Stage 3: Controlled Reflow
Custom reflow profiles optimized per BGA type. Nitrogen reflow available. Real-time temperature monitoring.
Stage 4: X-Ray Inspection (100% Coverage)
2D and 3D X-Ray on every BGA board. Void analysis; automated void calculation. Inspection results per board serial number.
Stage 5: Testing & Final Assembly
ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.
Stage-of-Life Support – Prototype through production—one partner for the entire journey
BGA Specialized Expertise – Process optimization per BGA type
Flexible Quantities – No MOQ; efficient small-batch production
Consistent Quality – 100% X-Ray regardless of quantity
Complete Turnkey – Sourcing through assembly and shipping—all under one roof
Studio delivers Low-Volume BGA Assembly—prototype to production with 100% X-Ray verification on every BGA board.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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