Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces/month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces/month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | bga assembly precision ，precision ball grid array assembly ，fine pitch bga assembly | ||
Overview
Ball Grid Array (BGA) components are at the heart of modern high-density electronics—enabling complex functionality in compact form factors. However, BGA assembly demands exceptional precision: solder joints are hidden beneath the component body, making visual inspection impossible and quality verification reliant on advanced X-Ray systems. Studio Electronics delivers Precision BGA Assembly with specialized expertise in fine-pitch and high-density BGA packages. As a premier provider of PCB assembly in China, we combine 12 fully automated SMT lines, specialized BGA placement capability, and advanced X-Ray inspection to deliver reliable BGA assemblies for the most demanding applications. Our complete turnkey service covers component procurement through final shipping, with 100% X-Ray verification on every BGA board.
Our BGA Assembly Capabilities – A Complete Overview
| BGA Type | Package Type | Studio's Capability | Quality Verification |
|---|---|---|---|
| Fine-Pitch BGA | 0.3mm – 0.5mm pitch | 12 SMT lines with ±25μm accuracy | 3D X-Ray void analysis; <15% void target |
| Standard BGA | 0.5mm – 0.8mm pitch | High-precision placement; controlled reflow | 2D X-Ray inspection; 100% coverage |
| Large BGA | Up to 50mm x 50mm | Specialized support; optimized reflow profile | X-Ray; electrical testing; functional validation |
| Micro BGA | 0.3mm pitch and below | Fine-pitch capability; nitrogen reflow | 3D X-Ray; precise void measurement |
| PBGA, CBGA, CCGA | Various substrate types | Process optimization per package type | Customized inspection protocols |
| BGA with Underfill | Structural reinforcement | Controlled underfill dispense; cure profiles | Underfill inspection; X-Ray verification |
Our Precision BGA Assembly Process
Why Choose Studio for Precision BGA Assembly?
Studio delivers Precision BGA Assembly—fine-pitch and ball grid array expertise with 100% X-Ray quality verification.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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